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 Freescale Semiconductor, Inc.
HC05RC16GRS/D REV. 3.0
Freescale Semiconductor, Inc...
General Release Specification
October 24, 1996
CSIC MCU Design Center Austin, Texas
For More Information On This Product, Go to: www.freescale.com
NON-DISCLOSURE
AGREEMENT
MC68HC05RC8 MC68HC05RC16
REQUIRED
Freescale Semiconductor, Inc. General Release Specification REQUIRED NON-DISCLOSURE
Freescale Semiconductor, Inc...
AGREEMENT
(c) Motorola, Inc., 1996
MC68HC05RC16 -- Rev. 3.0 For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
List of Sections
Section 1. General Description . . . . . . . . . . . . . . . . . . . 15
Freescale Semiconductor, Inc...
Section 2. Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Section 3. Central Processor Unit . . . . . . . . . . . . . . . . . 33 Section 4. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Section 5. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Section 6. Low-Power Modes . . . . . . . . . . . . . . . . . . . . 53 Section 7. Parallel Input/Output (I/O) . . . . . . . . . . . . . . 57 Section 8. Core Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Section 9. Carrier Modulator Transmitter (CMT) . . . . . . 67 Section 10. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . 85 Section 11. Electrical Specifications . . . . . . . . . . . . . . 103 Section 12. Mechanical Specifications . . . . . . . . . . . 111 Section 13. Ordering Information . . . . . . . . . . . . . . . . 115 Appendix A. MC68HC05RC8 . . . . . . . . . . . . . . . . . . . . 119
MC68HC05RC16 -- Rev. 3.0 List of Sections For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. List of Sections
Freescale Semiconductor, Inc...
General Release Specification List of Sections For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Table of Contents
Section 1. General Description
1.1 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Freescale Semiconductor, Inc...
1.2 1.3 1.4
1.5 Signal Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 1.5.1 VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 1.5.2 IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . .23 1.5.3 OSC1 and OSC2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.4 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.5 LPRST. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.6 IRO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.7 PA0-PA7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.8 PB0-PB7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.9 PC0-PC3 (PC4-PC7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Section 2. Memory
2.1 2.2 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
2.3 Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 2.3.1 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.2 ROM Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.3 RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 2.4 Input/Output Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
MC68HC05RC16 -- Rev. 3.0 Table of Contents For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Table of Contents Section 3. Central Processor Unit
3.1 3.2 3.3 3.4 3.5 3.6 3.7 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Index Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Condition Code Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
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Section 4. Interrupts
4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 CPU Interrupt Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Reset Interrupt Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Hardware Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 External Interrupt (IRQ/Port B Keyscan). . . . . . . . . . . . . . . . . .41 External Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Carrier Modulator Transmitter Interrupt (CMT) . . . . . . . . . . . . .42 Core Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Section 5. Resets
5.1 5.2 5.3 5.4 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 External Reset (RESET). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Low-Power External Reset (LPRST) . . . . . . . . . . . . . . . . . . . .48
General Release Specification Table of Contents For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Table of Contents
5.5 Internal Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 5.5.1 Power-On Reset (POR). . . . . . . . . . . . . . . . . . . . . . . . . . . .48 5.5.2 Computer Operating Properly Reset (COPR) . . . . . . . . . . .49 5.5.2.1 Resetting the COP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 5.5.2.2 COP During Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . .49 5.5.2.3 COP During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . .49 5.5.2.4 COP Watchdog Timer Considerations . . . . . . . . . . . . . . .50 5.5.2.5 COP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.3 Illegal Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Freescale Semiconductor, Inc...
Section 6. Low-Power Modes
6.1 6.2 6.3 6.4 6.5 6.6 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Stop Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Low-Power Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Section 7. Parallel Input/Output (I/O)
7.1 7.2 7.3 7.4 7.5 7.6 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Input/Output Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
MC68HC05RC16 -- Rev. 3.0 Table of Contents For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Table of Contents Section 8. Core Timer
8.1 8.2 8.3 8.4 8.5 8.6 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Core Timer Control and Status Register. . . . . . . . . . . . . . . . . .63 Core Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . .65 Computer Operating Properly (COP) Reset . . . . . . . . . . . . . . .66 Timer During Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Freescale Semiconductor, Inc...
Section 9. Carrier Modulator Transmitter (CMT)
9.1 9.2 9.3 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
9.4 Carrier Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 9.4.1 Time Counter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71 9.4.2 Carrier Generator Data Registers (CHR1, CLR1, CHR2, and CLR2) . . . . . . . . . . . . . . . . .72 9.5 Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74 9.5.1 Time Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 9.5.2 FSK Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 9.5.3 Extended Space Operation . . . . . . . . . . . . . . . . . . . . . . . . .78 9.5.3.1 End Of Cycle (EOC) Interrupt . . . . . . . . . . . . . . . . . . . . .79 9.5.3.2 Modulator Control and Status Register . . . . . . . . . . . . . .80 9.5.4 Modulator Period Data Registers (MDR1, MDR2, and MDR3) . . . . . . . . . . . . . . . . . . . . . .83
General Release Specification Table of Contents For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Table of Contents
Section 10. Instruction Set
10.1 10.2 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Freescale Semiconductor, Inc...
10.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86 10.3.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.4 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.5 Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 10.3.6 Indexed, 8-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 10.3.7 Indexed,16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 10.3.8 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89 10.4 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89 10.4.1 Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . .90 10.4.2 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .91 10.4.3 Jump/Branch Instructions . . . . . . . . . . . . . . . . . . . . . . . . . .92 10.4.4 Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . .94 10.4.5 Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 10.5 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
Section 11. Electrical Specifications
11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105 DC Electrical Characteristics (5.0 Vdc). . . . . . . . . . . . . . . . . .106 DC Electrical Characteristics (2.2 Vdc). . . . . . . . . . . . . . . . . .107 Control Timing (5.0 Vdc and 2.2 Vdc) . . . . . . . . . . . . . . . . . . .109
MC68HC05RC16 -- Rev. 3.0 Table of Contents For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Table of Contents Section 12. Mechanical Specifications
12.1 12.2 12.3 12.4 12.5 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 28-Pin Plastic Dual In-Line Package (Case 710-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112 28-Pin Small Outline Integrated Circuit Package (Case 751F-04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112 44-Pin Plastic Leaded Chip Carrier Package (Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Freescale Semiconductor, Inc...
Section 13. Ordering Information
13.1 13.2 13.3 13.4 13.5 13.6 13.7 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 MCU Ordering Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 Application Program Media. . . . . . . . . . . . . . . . . . . . . . . . . . .116 ROM Program Verification . . . . . . . . . . . . . . . . . . . . . . . . . . .117 ROM Verification Units (RVUs). . . . . . . . . . . . . . . . . . . . . . . .118 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
Appendix A. MC68HC05RC8
A.1 A.2 A.3 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
List of Figures
Figure 1-1 1-2 1-3 1-4 1-5 2-1 2-2 3-1 3-2 4-1 4-2 5-1 5-2 5-3 6-1 6-2 7-1 7-2 8-1 8-2 8-3
Title
Page
Freescale Semiconductor, Inc...
MC68HC05RC16 Block Diagram . . . . . . . . . . . . . . . . . . . . .18 28-Pin DIP Pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 28-Pin SOIC Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 44-Pin PLCC Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Oscillator Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 MC68HC05RC16 Memory Map . . . . . . . . . . . . . . . . . . . . . .28 I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Stacking Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Interrupt Processing Flowchart. . . . . . . . . . . . . . . . . . . . . . .40 IRQ Function Block Diagram . . . . . . . . . . . . . . . . . . . . . . . .41 Reset Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Reset and POR Timing Diagram . . . . . . . . . . . . . . . . . . . . .47 COP Watchdog Timer Location . . . . . . . . . . . . . . . . . . . . . .51 Stop Recovery Timing Diagram . . . . . . . . . . . . . . . . . . . . . .54 Stop/Wait Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Port B Pullup Option. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 I/O Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Core Timer Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . .62 Core Timer Control and Status Register (CTCSR) . . . . . . .63 Core Timer Counter Register (CTCR) . . . . . . . . . . . . . . . . .65
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General Release Specification
Freescale Semiconductor, Inc. List of Figures
Figure 9-1 9-2 9-3 9-4 9-5 9-6 9-7 9-8 9-9 9-10 9-11 9-12 9-13 11-1 Title Page
Freescale Semiconductor, Inc...
Carrier Modulator Transmitter Module Block Diagram . . . . .69 Carrier Generator Block Diagram . . . . . . . . . . . . . . . . . . . . .70 Carrier Generator Data Register CHR1 . . . . . . . . . . . . . . . .72 Carrier Generator Data Register CLR1 . . . . . . . . . . . . . . . .72 Carrier Generator Data Register CHR2 . . . . . . . . . . . . . . . .72 Carrier Generator Data Register CLR2 . . . . . . . . . . . . . . . .73 Modulator Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .75 CMT Operation in Time Mode . . . . . . . . . . . . . . . . . . . . . . .77 Extended Space Operation . . . . . . . . . . . . . . . . . . . . . . . . .79 Modulator Control and Status Register (MCSR) . . . . . . . . .80 Modulator Period Data Register MDR1 . . . . . . . . . . . . . . . .83 Modulator Period Data Register MDR2 . . . . . . . . . . . . . . . .83 Modulator Period Data Register MDR3 . . . . . . . . . . . . . . . .83 Maximum Supply Current versus Internal Clock Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108 MC68HC05RC8 Memory Map . . . . . . . . . . . . . . . . . . . . .120
A-1
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
List of Tables
Table 4-1
Title
Page
Vector Address for Interrupts and Reset ................................38 COP Watchdog Timer Recommendations .............................50 I/O Pin Functions ....................................................................59 RTI and COP Rates at 4.096 MHz Oscillator .........................64 Register/Memory Instructions.................................................90 Read-Modify-Write Instructions ..............................................91 Jump and Branch Instructions ................................................93 Bit Manipulation Instructions...................................................94 Control Instructions.................................................................95 Instruction Set Summary ........................................................96 Opcode Map .........................................................................102 MC Order Numbers ..............................................................118
Freescale Semiconductor, Inc...
5-1 7-1 8-1 10-1 10-2 10-3 10-4 10-5 10-6 10-7 13-1
MC68HC05RC16 -- Rev. 3.0 List of Tables For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. List of Tables
Freescale Semiconductor, Inc...
General Release Specification List of Tables For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Section 1. General Description
1.1 Contents
1.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Freescale Semiconductor, Inc...
1.3 1.4
1.5 Signal Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 1.5.1 VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 1.5.2 IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . .23 1.5.3 OSC1 and OSC2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.4 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.5 LPRST. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.6 IRO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.7 PA0-PA7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.8 PB0-PB7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.9 PC0-PC3 (PC4-PC7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
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General Release Specification
Freescale Semiconductor, Inc. General Description 1.2 Introduction
The MC68HC05RC16 is a low-cost addition to the M68HC05 Family of microcontrollers (MCUs) and is suitable for remote control applications. This device contains the HC05 central processing unit (CPU) core, including the 14-stage core timer with real-time interrupt (RTI) and computer operating properly (COP) watchdog systems. On-chip peripherals include a carrier modulator transmitter. The 16-kbyte memory map has 15,936 bytes of user ROM and 352 bytes of RAM. There are 20 input/output (I/O) lines (eight having keyscan pullups/interrupts) and a low-power reset pin. This device is available in 28-pin small outline integrated circuit (SOIC), 28-pin dual in-line (DIP), and 44-pin plastic leaded chip carrier (PLCC) packages. Four additional I/O lines are available for bond out on the higher pin count package.
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1.3 Features
Features for the MC68HC05RC16 include: * * * * * * * * * * * Low Cost HC05 Core 28-Pin Plastic Dual In-Line (PDIP), Small Outline Integrated Circuit (SOIC), or Plastic Leaded Chip Carrier (PLCC) Packages On-Chip Oscillator with Crystal/Ceramic Resonator 4-MHz Maximum Oscillator Frequency at 5 V and 2.2 V Supply Fully Static Operation 15,936 Bytes of User ROM 64 Bytes of Burn-In ROM 352 Bytes of On-Chip RAM 14-Stage Core Timer with Real-Time Interrupt (RTI) and Computer Operating Properly (COP) Watchdog Circuits Carrier Modulator Transmitter Supporting Baseband, Pulse Length Modulator (PLM), and Frequency Shift Keying (FSK) Protocols
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Description Features
* * * * *
Low-Power Reset Pin 20 Bidirectional I/O Lines (Four Additional I/O Lines Available for Bond Out in 44-Lead PLCC Package) Mask Programmable Pullups and Interrupts on Eight Port Pins (PB0-PB7) High-Current Infrared (IR) Drive Pin High-Current Port Pin (PC0) Power-Saving Stop and Wait Modes Mask Selectable Options: - COP Watchdog Timer - STOP Instruction Disable - Edge-Sensitive or Edge- and Level-Sensitive Interrupt Trigger - Port B Pullups for Keyscan
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* *
* *
Illegal Address Reset ROM Security Feature
NOTE:
A line over a signal name indicates an active low signal. For example, RESET is active low.
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General Release Specification
Freescale Semiconductor, Inc. General Description
OSC2 OSC1 VDD VSS
OSCILLATOR IRQEN /2 INTERNAL PROCESSOR CLOCK
CARRIER MODULATOR TRANSMITTER
IRO
PC0 DATA DIRECTION REGISTER PC1 PC2 PORT C PC3 PC4* PC5* PC6* PC7*
COP SYSTEM
RTI SYSTEM
CORE TIMER SYSTEM
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RESET LPRST CPU CONTROL M68HC05 CPU CPU REGISTERS IRQEN 0 IRQ 00 0 0 0 0 1 1 ACCUMULATOR INDEX REGISTER STACK POINTER ALU
PA0 DATA DIRECTION REGISTER PA1 PA2 PORT A PA3 PA4 PA5 PA6 PA7 PB0 SRAM -- 352 BYTES DATA DIRECTION REGISTER PB1 KEYSCAN PULLUPS PB2 PB3 PB4 PB5 PB6 PB7
PROGRAM COUNTER 11 1H I NZ C
CONDITION CODE REGISTER
ROM -- 15,936 BYTES
BURN-IN ROM -- 64 BYTES
* Marked pins are available only 44-lead PLCC package.
Figure 1-1. MC68HC05RC16 Block Diagram
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MC68HC05RC16 -- Rev. 3.0
PORT B
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General Description Mask Options
1.4 Mask Options
There are 11 total mask options on the MC68HC05RC16 including: * * * * Eight port B pullups IRQ sensitivity COP enable/disable STOP enable/disable
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These are nonprogrammable options in that they are selected at the time of code submission (when masks are made). These options are as follows: PB7PU -- Port B7 Pullup/Interrupt This bit enables or disables the pullup/interrupt on port B, bit 7. 1 = Enables the pullup/interrupt 0 = Disables the pullup/interrupt PB6PU -- Port B6 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 6. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB5PU -- Port B5 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 5. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB4PU -- Port B4 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 4. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB3PU -- Port B3 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 3. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt
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General Release Specification
Freescale Semiconductor, Inc. General Description
PB2PU -- Port B2 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 2. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB1PU -- Port B1 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 1. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt
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PB0PU -- Port B0 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 0. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt COPEN -- COP Enable When the COP option is selected (COPEN = 1), the COP watchdog timer is enabled. When the COP option is deselected (COPEN = 0), the COP watchdog timer is disabled. STOPEN -- STOP Instruction Enable When the STOP option is selected (STOPEN = 1), the STOP instruction is enabled. When the STOP option is deselected (STOPEN = 0), the STOP instruction is equivalent to a WAIT instruction. IRQ -- IRQ sensitivity When the IRQ option is selected (IRQ = 1), edge- and level-sensitive IRQ is enabled. When the IRQ option is deselected (IRQ = 0), edge-only sensitive IRQ is enabled.
NOTE:
The port B keyscan interrupt sensitivity will match that of the IRQ sensitivity. (See 4.7 External Interrupt (IRQ/Port B Keyscan) for more information.)
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Description Signal Description
1.5 Signal Description
The MC68HC05RC16 is available in 1. 28-pin dual-in-line package (DIP) see Figure 1-2 2. 28-pin small outline integrated circuit (SOIC) package see Figure 1-3 3. 44-pin plastic leaded chip carrier (PLCC) package see Figure 1-4 The signals are described in the following subsections.
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PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
OSC1 OSC2 VDD IRQ RESET IRO VSS LPRST PC3 PC2 PC1 PC0 PA7 PA6
Figure 1-2. 28-Pin DIP Pinout
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General Release Specification
Freescale Semiconductor, Inc. General Description
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
OSC1 OSC2 VDD IRQ RESET IRO VSS LPRST PC3 PC2 PC1 PC0 PA7 PA6
Freescale Semiconductor, Inc...
Figure 1-3. 28-Pin SOIC Pinout
OSC1
OSC2
PB3
PB2
PB1
PB0
VDD 42
1 NC
IRQ 41
NC
44
NC PB4 PB5 PB6 PB7 NC PC6 PC7 PA0 PA1 NC
43
40
6
5
4
3
2
NC
7 8 9 10 11 12 13 14 15 16 18 19 20 21 22 23 24 25 26 27 28 17
39 38 37 36 35 34 33 32 31 30 29
NC RESET IRO VSS LPRST NC PC5 PC4 PC3 PC2 NC
PA2
PA3
PA4
PA5
PA6
PA7
PC0
PC1
NC
NC
NOTE: NC = No Connect All no connects should be tied to an appropriate logic level (either VDD or VSS).
Figure 1-4. 44-Pin PLCC Pinout
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MC68HC05RC16 -- Rev. 3.0
NC
Freescale Semiconductor, Inc.
General Description Signal Description
1.5.1 VDD and VSS Power is supplied to the microcontroller's digital circuits using these two pins. VDD is the positive supply and VSS is ground. 1.5.2 IRQ (Maskable Interrupt Request) In addition to suppling the EPROM with the required programming voltage, this pin has a mask option as specified by the user that provides one of two different choices of interrupt triggering sensitivity. The options are: 1. Negative edge-sensitive triggering only 2. Both negative edge-sensitive and level-sensitive triggering. The MCU completes the current instruction before it responds to the interrupt request. When IRQ goes low for at least one tILIH (see 11.8 Control Timing (5.0 Vdc and 2.2 Vdc)), a logic 1 is latched internally to signify that an interrupt has been requested. When the MCU completes its current instruction, the interrupt latch is tested. If the interrupt latch contains a logic 1 and the interrupt mask bit (I bit) in the condition code register is clear, the MCU then begins the interrupt sequence. If the option is selected to include level-sensitive triggering, the IRQ input requires an external resistor to VDD for wired-OR operation. The IRQ pin contains an internal Schmitt trigger as part of its input to improve noise immunity. Refer to Section 4. Interrupts for more detail.
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MC68HC05RC16 -- Rev. 3.0 General Description For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. General Description
1.5.3 OSC1 and OSC2 These pins provide control input for an on-chip clock oscillator circuit. A crystal, a ceramic resonator, or an external signal connects to these pins to provide a system clock. The oscillator frequency is two times the internal bus rate. Figure 1-5 shows the recommended circuit when using a crystal. The crystal and components should be mounted as close as possible to the input pins to minimize output distortion and startup stabilization time.
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A ceramic resonator may be used in place of the crystal in cost-sensitive applications. Figure 1-5 (a) shows the recommended circuit for using a ceramic resonator. The manufacturer of the particular ceramic resonator being considered should be consulted for specific information. An external clock should be applied to the OSC1 input with the OSC2 pin not connected (see Figure 1-5 (b)). This setup can be used if the user does not want to run the CPU with a crystal.
MCU OSC1 OSC2 OSC1
MCU OSC2
10 M
UNCONNECTED
< EXTERNAL CLOCK 30 pF 30 pF
(a) Crystal/Ceramic Resonator Oscillator Connections
(b) External Clock Source Connections
Figure 1-5. Oscillator Connections
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Description Signal Description
1.5.4 RESET This active-low pin is used to reset the MCU to a known startup state by pulling RESET low. The RESET pin contains an internal Schmitt trigger as part of its input to improve noise immunity. See Section 5. Resets.
1.5.5 LPRST The LPRST pin is an active-low pin and is used to put the MCU into low-power reset mode. In low-power reset mode the MCU is held in reset with all processor clocks halted. See Section 5. Resets.
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1.5.6 IRO The IRO pin is the high-current source and sink output of the carrier modulator transmitter subsystem which is suitable for driving infrared (IR) LED biasing logic. See Section 9. Carrier Modulator Transmitter (CMT).
1.5.7 PA0-PA7 These eight I/O lines comprise port A. The state of any pin is software programmable and all port A lines are configured as inputs during power-on or reset. For detailed information on I/O programming, see 2.4 Input/Output Programming.
1.5.8 PB0-PB7 These eight I/O lines comprise port B. The state of any pin is software programmable and all port B lines are configured as inputs during power-on or reset. Each port B I/O line has a mask optionable pullup/interrupt for keyscan. For detailed information on I/O programming, see 2.4 Input/Output Programming.
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General Release Specification
Freescale Semiconductor, Inc. General Description
1.5.9 PC0-PC3 (PC4-PC7) These eight I/O lines comprise port C. PC0 is a high-current pin. PC4-PC7 are available only in the 44-lead PLCC package. The state of any pin is software programmable and all port C lines are configured as input during power-on or reset. For detailed information on I/O programming, see 2.4 Input/Output Programming.
NOTE:
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Only four bits of port C are bonded out in 28-pin packages for the MC68HC05RC16, although port C is truly an 8-bit port. Since pins PC4-PC7 are unbonded, software should include the code to set their respective data direction register locations to outputs to avoid floating inputs. Any unused inputs, I/O ports, and no connects should be tied to an appropriate logic level (either VDD or VSS). Although the I/O ports of the do not require termination, termination is recommended to reduce the possibility of static damage.
NOTE:
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Section 2. Memory
2.1 Contents
2.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
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2.3 Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 2.3.1 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.2 ROM Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.3 RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 2.4 Input/Output Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
2.2 Introduction
This section describes the organization of the on-chip memory.
2.3 Memory Map
The MC68HC05RC16 has a 16-Kbyte memory map consisting of user ROM, RAM, burn-in ROM, and input/output (I/O). Figure 2-1 shows the MC68HC05RC16 memory map in user mode.
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General Release Specification
Freescale Semiconductor, Inc. Memory
$0000 $001F $0020
I/O 32 BYTES
0000 0031 0032
PORT A DATA REGISTER PORT B DATA REGISTER PORT C DATA REGISTER RESERVED PORT A DATA DIRECTION REGISTER
$00 $01 $02 $03 $04 $05 $06 $07
RAM 160 BYTES $00BF $00C0 $00FF $0100 $017F $0180 0191 0192 0255 0256 0383 0384
PORT B DATA DIRECTION REGISTER PORT C DATA DIRECTION REGISTER RESERVED
STACK 64 BYTES RAM 128 BYTES
CORE TIMER CONTROL & STATUS REG. $08 CORE TIMER COUNTER REGISTER RESERVED $09 $0A
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.......
$3FAF $3FB0 BURN-IN ROM & VECTORS 64 BYTES USER VECTORS 16 BYTES
16303 16304
RESERVED IR TIMER CHR1 IR TIMER CLR1 IR TIMER CHR2 IR TIMER CLR2 IR TIMER MCSR IR TIMER MDR1 IR TIMER MDR2 IR TIMER MDR3 RESERVED RESERVED RESERVED UNUSED UNUSED CORE TIMER VECTOR (HIGH BYTE) CORE TIMER VECTOR (LOW BYTE) IR TIMER VECTOR (HIGH BYTE) IR TIMER VECTOR (LOW BYTE) IRQ/PTB KEYSCAN PULLUPS VECTOR (HIGH BYTE) IRQ/PTB KEYSCAN PULLUPS VECTOR (LOW BYTE) SWI VECTOR (HIGH BYTE) SWI VECTOR (LOW BYTE) RESET VECTOR (HIGH BYTE) RESET VECTOR (LOW BYTE)
$3FEF $3FF0 $3FFF
16367 16368 16383
Figure 2-1. MC68HC05RC16 Memory Map
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...
$3FF5 $3FF6 $3FF7 $3FF8 $3FF9 $3FFA $3FFB $3FFC $3FFD $3FFE $3FFF
..
$1E $1F $3FF0
.......
$0F $10 $11 $12 $13 $14 $15 $16 $17 $18
USER ROM 15,920 BYTES
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Memory Memory Map
Addr. $0000 $0001 $0002 $0003 $0004 $0005
Register Port A Data Register Port B Data Register Port C Data Register Reserved Port A Data Direction Register Port B Data Direction Register Port C Data Direction Register Reserved
Bit 7
6
5
4
3
2
1
Bit 0
R
R
R
R
R
R
R
R
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$0006 $0007 $0008 $0009 $000A $000B $000C $000D $000E $000F $0010 $0011 $0012 $0013 $0014 $0015 $0016 $0017 $0018 $0019
R
R RTIF
R TOFE
R RTIE
R TOFC
R RTFC
R RT1
R RT0
Timer Control and Status Reg. CTOF Timer Counter Register Reserved Reserved Reserved Reserved Reserved Reserved R R R R R R
R R R R R R 0 0 0 0 0 MB10 MB6 SB6 R R
R R R R R R PH5 PL5 SH5 SL5 EIMSK MB9 MB5 SB5 R R
R R R R R R PH4 PL4 SH4 SL4 EXMRK MB8 MB4 SB4 R R
R R R R R R PH3 PL3 SH3 SL3 BASE SB11 MB3 SB3 R R
R R R R R R PH2 PL2 SH2 SL2 MODE SB10 MB2 SB2 R R
R R R R R R PH1 PL1 SH1 SL1 EOCIE SB9 MB1 SB1 R R
R R R R R R PH0 PL0 SH0 SL0 MCGEN SB8 MB0 SB0 R R
IR Timer CHR1 IROLN IR Timer CLR1 IROLP IR Timer CHR2 IR Timer CLR2 IR Timer MCSR 0 0 EOC
IR Timer MDR1 MB11 IR Timer MDR2 IR Timer MDR3 Reserved Reserved MB7 SB7 R R
R
= Reserved
Figure 2-2. I/O Registers
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General Release Specification
Freescale Semiconductor, Inc. Memory
Addr. $001A $001B $001C $001D $001E $001F
Register Reserved Reserved Reserved Reserved Reserved Reserved
Bit 7 R R R R R R
6 R R R R R R
5 R R R R R R
4 R R R R R R
3 R R R R R R
2 R R R R R R
1 R R R R R R
Bit 0 R R R R R R
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R
= Reserved
Figure 2-2. I/O Registers (Continued) 2.3.1 ROM The user ROM consists of 15,920 bytes of ROM located from $0180 to $3FAF and 16 bytes of user vectors located from $3FF0 to $3FFF. The burn-in ROM is located from $3FB0 to $3FEF. Ten of the user vectors, $3FF6-$3FFF, are dedicated to reset and interrupt vectors. The six remaining locations -- $3FF0, $3FF1, $3FF2, $3FF3, $3FF4, and $3FF5 -- are general-purpose user ROM locations.
2.3.2 ROM Security Security has been incorporated into the MC68HC05RC16 to prevent external viewing of the ROM contents. This feature ensures that customer-developed software remains proprietary.1
1. No security feature is absolutely secure. However, Motorola's strategy is to make reading or copying the ROM difficult for unauthorized users.
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Memory Input/Output Programming
2.3.3 RAM The user RAM consists of 352 bytes of a shared stack area. The RAM starts at address $0020 and ends at address $017F. The stack begins at address $00FF. The stack pointer can access 64 bytes of RAM in the range $00FF to $00C0.
NOTE:
Using the stack area for data storage or temporary work locations requires care to prevent it from being overwritten due to stacking from an interrupt or subroutine call.
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2.4 Input/Output Programming
In user mode, 20 lines (28-pin PDIP or 28-pin SOIC) or 24 lines (44-lead PLCC) are arranged as three 8-bit I/O ports. These ports are programmable as either inputs or outputs under software control of the data direction registers. For detailed information, refer to Section 7. Parallel Input/Output (I/O).
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General Release Specification
Freescale Semiconductor, Inc. Memory
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General Release Specification Memory For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Section 3. Central Processor Unit
3.1 Contents
3.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Index Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Condition Code Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
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3.3 3.4 3.5 3.6 3.7
3.2 Introduction
This section describes the registers of the MC68HC05RC16 central processor unit (CPU). The MCU contains five registers as shown in Figure 3-1. The interrupt stacking order is shown in Figure 3-2.
7 A 7 X 13 PC 13 0 0 0 0 0 0 7 1 1 SP CCR H I N Z C CONDITION CODE REGISTER 0 STACK POINTER 0 PROGRAM COUNTER 0 INDEX REGISTER 0 ACCUMULATOR
Figure 3-1. Programming Model
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Freescale Semiconductor, Inc. Central Processor Unit
7 1 INCREASING MEMORY ADDRESSES R E T U R N 1 1
0 CONDITION CODE REGISTER ACCUMULATOR INDEX REGISTER PCH PCL
STACK I N T E R R U P T
DECREASING MEMORY ADDRESSES
UNSTACK NOTE: Since the stack pointer decrements during pushes, the PCL is stacked first, followed by PCH, etc. Pulling from the stack is in the reverse order.
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Figure 3-2. Stacking Order
3.3 Accumulator
The accumulator (A) is a general-purpose 8-bit register used to hold operands and results of arithmetic calculations or data manipulations.
7 A 0
3.4 Index Register
The index register (X) is an 8-bit register used for the indexed addressing value to create an effective address. The index register also may be used as a temporary storage area.
7 X 0
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MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Central Processor Unit Condition Code Register
3.5 Condition Code Register
The condition code register (CCR) is a 5-bit register in which four bits are used to indicate the results of the instruction just executed, and the fifth bit indicates whether interrupts are masked. These bits can be tested individually by a program, and specific actions can be taken as a result of their state. Each bit is explained in the following paragraphs.
CCR H I N Z C
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H -- Half Carry This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4. I -- Interrupt When this bit is set, timer and external interrupts are masked (disabled). If an interrupt occurs while this bit is set, the interrupt is latched and processed as soon as the interrupt bit is cleared. N -- Negative When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was negative. Z -- Zero When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was zero. C -- Carry/Borrow When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred during the last arithmetic operation. This bit is also affected during bit test and branch instructions and during shifts and rotates.
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Freescale Semiconductor, Inc. Central Processor Unit 3.6 Stack Pointer
The stack pointer (SP) contains the address of the next free location on the stack. During an MCU reset or the reset stack pointer (RSP) instruction, the stack pointer is set to location $00FF. The stack pointer is then decremented as data is pushed onto the stack and incremented as data is pulled from the stack. When accessing memory, the seven most significant bits are permanently set to 0000011. These seven bits are appended to the six least significant register bits to produce an address within the range of $00FF to $00C0. Subroutines and interrupts may use up to 64 (decimal) locations. If 64 locations are exceeded, the stack pointer wraps around and loses the previously stored information. A subroutine call occupies two locations on the stack; an interrupt uses five locations.
13 0 0 0 0 0 1 7 1 SP 0
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3.7 Program Counter
The program counter (PC) is a 13-bit register that contains the address of the next byte to be fetched.
13 PC 0
NOTE:
The HC05 CPU core is capable of addressing a 64-Kbyte memory map. For this implementation, however, the addressing registers are limited to an 16-Kbyte memory map.
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General Release Specification -- MC68HC05RC16
Section 4. Interrupts
4.1 Contents
4.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 CPU Interrupt Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Reset Interrupt Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Hardware Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 External Interrupt (IRQ/Port B Keyscan). . . . . . . . . . . . . . . . . .41 External Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Carrier Modulator Transmitter Interrupt (CMT) . . . . . . . . . . . . .42 Core Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
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4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10
4.2 Introduction
The MCU can be interrupted four different ways: 1. Nonmaskable software interrupt instruction (SWI) 2. External asynchronous interrupt (IRQ/port B keyscan) 3. Internal carrier modulator transmitter interrupt 4. Internal core timer interrupt
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Freescale Semiconductor, Inc. Interrupts 4.3 CPU Interrupt Processing
Interrupts cause the processor to save register contents on the stack and to set the interrupt mask (I bit) to prevent additional interrupts. Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but are considered pending until the current instruction is complete. If interrupts are not masked (I bit in the CCR is clear) and the corresponding interrupt enable bit is set, the processor will proceed with interrupt processing. Otherwise, the next instruction is fetched and executed. If an interrupt occurs, the processor completes the current instruction, stacks the current CPU register state, sets the I bit to inhibit further interrupts, and finally checks the pending hardware interrupts. If more than one interrupt is pending after the stacking operation, the interrupt with the highest vector location shown in Table 4-1 will be serviced first. The SWI is executed the same as any other instruction, regardless of the I-bit state. When an interrupt is to be processed, the CPU fetches the address of the appropriate interrupt software service routine from the vector table at locations $3FF6-$3FFF as defined in Table 4-1. Table 4-1. Vector Address for Interrupts and Reset
Register N/A N/A N/A MCSR Flag Name N/A N/A N/A EOC CTOF, RTIF Interrupt Reset Software Interrupt External Interrupts* End of Cycle Interrupt Real-Time Interrupt Core Timer Overflow CPU Interrupt RESET SWI IRQ CMT CORE TIMER Vector Address $3FFE-$3FFF $3FFC-$3FFD $3FFA-$3FFB $3FF8-$3FF9
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CTCSR
$3FF6-$3FF7
*External interrupts include IRQ and port B keyscan sources.
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Interrupts Reset Interrupt Sequence
The M68HC05 CPU does not support interruptible instructions. The maximum latency to the first instruction of the interrupt service routine must include the longest instruction execution time plus stacking overhead. Latency = (Longest instruction execution time + 10) x tcyc seconds An RTI instruction is used to signify when the interrupt software service routine is completed. The RTI instruction causes the register contents to be recovered from the stack and normal processing to resume at the next instruction that was to be executed when the interrupt took place. Figure 4-1 shows the sequence of events that occurs during interrupt processing.
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4.4 Reset Interrupt Sequence
The reset function is not in the strictest sense an interrupt; however, it is acted upon in a similar manner as shown in Figure 4-1. A low-level input on the RESET pin or an internally generated RST signal causes the program to vector to its starting address, which is specified by the contents of memory locations $3FFE and $3FFF. The I bit in the condition code register is also set. The MCU is configured to a known state during this type of reset.
4.5 Software Interrupt (SWI)
The SWI is an executable instruction and a nonmaskable interrupt since it is executed regardless of the state of the I bit in the CCR. If the I bit is zero (interrupts enabled), the SWI instruction executes after interrupts that were pending before the SWI was fetched or before interrupts generated after the SWI was fetched. The interrupt service routine address is specified by the contents of memory locations $3FFC and $3FFD.
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FROM RESET
Y
I BIT IN CCR SET? N IRQ/PORT B KEYSCAN EXTERNAL INTERRUPTS Y EIMSK CLEAR? N Y Y CLEAR IRQ REQUEST LATCH.
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N INTERNAL CMT INTERRUPT N INTERNAL CORE TIMER INTERRUPT N Y
STACK PC, X, A, CCR. FETCH NEXT INSTRUCTION.
SET I BIT IN CC REGISTER.
SWI INSTRUCTION ? N Y RTI INSTRUCTION ? N RESTORE REGISTERS FROM STACK: CCR, A, X, PC. EXECUTE INSTRUCTION.
Y
LOAD PC FROM APPROPRIATE VECTOR.
Figure 4-1. Interrupt Processing Flowchart
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Interrupts Hardware Interrupts
4.6 Hardware Interrupts
All hardware interrupts except RESET are maskable by the I bit in the CCR. If the I bit is set, all hardware interrupts (internal and external) are disabled. Clearing the I bit enables the hardware interrupts. The three types of hardware interrupts are explained in the following sections.
4.7 External Interrupt (IRQ/Port B Keyscan)
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The IRQ pin provides an asynchronous interrupt to the CPU. A block diagram of the IRQ function is shown in Figure 4-2.
NOTE:
The BIH and BIL instructions will apply to the level on the IRQ pin itself and to the output of the logic OR function with the port B IRQ interrupts. The states of the individual port B pins can be checked by reading the appropriate port B pins as inputs.
The IRQ pin is one source of an external interrupt. All port B pins (PB0-PB7) act as other external interrupt sources if the pullup feature is enabled as specified by the user.
EIMSK IRQ PIN PORT B KEYSCAN INTERRUPT IRQ VECTOR FETCH RST LEVEL (MASK OPTION)
VDD
TO BIH & BIL INSTRUCTION SENSING IRQ LATCH R
TO IRQ PROCESSING IN CPU
Figure 4-2. IRQ Function Block Diagram
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Freescale Semiconductor, Inc. Interrupts
When edge sensitivity is selected for the IRQ interrupt, it is sensitive to these cases: 1. Falling edge on the IRQ pin 2. Falling edge on any port B pin with pullup enabled When edge and level sensitivity is selected for the IRQ interrupt, it is sensitive to these cases: 1. Low level on the IRQ pin
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2. Falling edge on the IRQ pin 3. Falling edge or low level on any port B pin with pullup enabled External interrupts also can be masked by setting the EIMSK bit in the MSCR register of the IR remote timer. See 9.5.4 Modulator Period Data Registers (MDR1, MDR2, and MDR3) for details.
4.8 External Interrupt Timing
If the interrupt mask bit (I bit) of the CCR is set, all maskable interrupts (internal and external) are disabled. Clearing the I bit enables interrupts. The interrupt request is latched immediately following the falling edge of the IRQ source. It is then synchronized internally and serviced as specified by the contents of $3FFA and $3FFB. Either a level-sensitive and edge-sensitive trigger or an edge-sensitive-only trigger is available via the mask programmable option for the IRQ pin.
4.9 Carrier Modulator Transmitter Interrupt (CMT)
A CMT interrupt occurs when the end of cycle flag (EOC) and the end of cycle interrupt enable (EOCIE) bits are set in the modulator control and status register (MCSR). This interrupt will vector to the interrupt service routine located at the address specified by the contents of memory locations $3FF8 and $3FF9.
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Interrupts Core Timer Interrupt
4.10 Core Timer Interrupt
This timer can create two types of interrupts. A timer overflow interrupt occurs whenever the 8-bit timer rolls over from $FF to $00 and the enable bit TOFE is set. A real-time interrupt occurs whenever the programmed time elapses and the enable bit RTIE is set. Either of these interrupts vectors to the same interrupt service routine, located at the address specified by the contents of memory locations $3FF6 and $3FF7.
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Freescale Semiconductor, Inc. Interrupts
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General Release Specification -- MC68HC05RC16
Section 5. Resets
5.1 Contents
5.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 External Reset (RESET). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Low-Power External Reset (LPRST) . . . . . . . . . . . . . . . . . . . .48
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5.3 5.4
5.5 Internal Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 5.5.1 Power-On Reset (POR). . . . . . . . . . . . . . . . . . . . . . . . . . . .48 5.5.2 Computer Operating Properly Reset (COPR) . . . . . . . . . . .49 5.5.2.1 Resetting the COP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 5.5.2.2 COP During Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . .49 5.5.2.3 COP During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . .49 5.5.2.4 COP Watchdog Timer Considerations . . . . . . . . . . . . . . .50 5.5.2.5 COP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.3 Illegal Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
5.2 Introduction
The MCU can be reset from five sources: two external inputs and three internal restart conditions. The RESET and LPRST pins are inputs as shown in Figure 5-1. All the internal peripheral modules will be reset by the internal reset signal (RST). Refer to Figure 5-2 for reset timing detail.
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Freescale Semiconductor, Inc. Resets 5.3 External Reset (RESET)
The RESET pin is one of the two external sources of a reset. This pin is connected to a Schmitt trigger input gate to provide an upper and lower threshold voltage separated by a minimum amount of hysteresis. This external reset occurs whenever the RESET pin is pulled below the lower threshold and remains in reset until the RESET pin rises above the upper threshold. This active-low input will generate the RST signal and reset the CPU and peripherals. Termination of the external RESET input or the internal COP watchdog reset are the only reset sources that can alter the operating mode of the MCU.
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NOTE:
Activation of the RST signal is generally referred to as reset of the device, unless otherwise specified.
IRQ D LATCH RESET R CLOCKED
TO IRQ LOGIC MODE SELECT
OSC DATA ADDRESS LPRST
COP WATCHDOG (COPR) CPU S D LATCH PH2 TO OTHER PERIPHERALS
VDD
POWER-ON RESET (POR) ILLEGAL ADDRESS (ILLADDR)
RST
ADDRESS
Figure 5-1. Reset Block Diagram
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MOTOROLA Resets 47
MC68HC05RC16 -- Rev. 3.0 General Release Specification
VDD 0V > VPOR 4
OSC12 4064 tCYC tCYC
INTERNAL PROCESSOR CLOCK1 INTERNAL ADDRESS BUS1 INTERNAL DATA BUS1
3FFE
3FFF
NEW PC NEW PC
3FFE
3FFE
3FFE
3FFE
3FFF
NEW PC NEW PC
NEW PCH
NEW PCL
OP CODE tRL 3
PCH
PCL
OP CODE
RESET5
NOTES: 1. Internal timing signal and bus information are not available externally. 2. OSC1 line is not meant to represent frequency. It is only used to represent time. 3. The next rising edge of the internal processor clock following the rising edge of RESET initiates the reset sequence. 4. VDD must fall to a level lower than VPOR to be recognized as a power-on reset. 5. The LPRST pin resets the CPU like RESET. However, 4064 POR cycles are executed first, before the reset vector address appears on the internal address bus. (See 5.4 Low-Power External Reset (LPRST).)
Resets External Reset (RESET)
Figure 5-2. Reset and POR Timing Diagram
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The LPRST pin is one of the two external sources of a reset. This external reset occurs whenever the LPRST pin is pulled below the lower threshold and remains in reset until the LPRST pin rises. This active low input will, in addition to generating the RST signal and resetting the CPU and peripherals, halt all internal processor clocks. The MCU will remain in this low-power reset condition as long as a logic 0 remains on LPRST. When a logic 1 is applied to LPRST, processor clocks will be re-enabled with the MCU remaining in reset until the 4064 internal processor clock cycle (tcyc) oscillator stabilization delay is completed. If any other reset function is active at the end of this 4064-cycle delay, the RST signal remains in the reset condition until the other reset condition(s) end.
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5.5 Internal Resets
The three internally generated resets are the initial power-on reset function, the COP watchdog timer reset, and the illegal address detector. Termination of the external reset input, external LPRST input, or the internal COP watchdog timer are the only reset sources that can alter the operating mode of the MCU. The other internal resets do not have any effect on the mode of operation when their reset state ends.
5.5.1 Power-On Reset (POR) The internal POR is generated on power-up to allow the clock oscillator to stabilize. The POR is strictly for power turn-on conditions and is not able to detect a drop in the power supply voltage (brown-out). There is an oscillator stabilization delay of 4064 internal processor bus clock cycles (PH2) after the oscillator becomes active. The POR generates the RST signal that resets the CPU. If any other reset function is active at the end of this 4064-cycle delay, the RST signal remains in the reset condition until the other reset condition(s) ends.
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Resets Internal Resets
5.5.2 Computer Operating Properly Reset (COPR) The MCU contains a watchdog timer that automatically times out if not reset (cleared) within a specific time by a program reset sequence. If the COP watchdog timer is allowed to time out, an internal reset is generated to reset the MCU. The COP reset function is enabled or disabled by a mask option and is verified during production testing.
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5.5.2.1 Resetting the COP Writing a zero to the COPF bit prevents a COP reset. This action resets the counter and begins the time-out period again. The COPF bit is bit 0 of address $3FF0. A read of address $3FF0 returns user data programmed at that location. 5.5.2.2 COP During Wait Mode The COP continues to operate normally during wait mode. The software should pull the device out of wait mode periodically and reset the COP by writing to the COPF bit to prevent a COP reset. 5.5.2.3 COP During Stop Mode When the stop enable mask option is selected, stop mode disables the oscillator circuit and thereby turns the clock off for the entire device. When stop is executed, the COP counter will hold its current state. If a reset is used to exit stop mode, the COP counter is reset and held until 4064 POR cycles are completed at this time, counting will begin. If an external IRQ is used to exit stop mode, the COP counter does not wait for the completion of the 4064 POR cycles but does count these cycles. It is, therefore, recommended that the COP is fed before executing the STOP instruction.
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5.5.2.4 COP Watchdog Timer Considerations The COP watchdog timer is active in all modes of operation if enabled by a mask option. If the COP watchdog timer is selected by a mask option, any execution of the STOP instruction (either intentionally or inadvertently due to the CPU being disturbed) causes the oscillator to halt and prevents the COP watchdog timer from timing out. If the COP watchdog timer is selected by a mask option, the COP resets the MCU when it times out. Therefore, it is recommended that the COP watchdog be disabled for a system that must have intentional uses of the wait mode for periods longer than the COP time out period. The recommended interactions and considerations for the COP watchdog timer, STOP instruction, and WAIT instruction are summarized in Table 5-1. Table 5-1. COP Watchdog Timer Recommendations
IF the Following Conditions Exist: Wait Time Wait Time Less than COP Time-Out Wait Time More than COP Time-Out Any Length Wait Time THEN the COP Watchdog Timer Should Be as Follows: Enable or Disable COP by Mask Option Disable COP by Mask Option Disable COP by Mask Option
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Resets Internal Resets
5.5.2.5 COP Register The COP register is shared with the LSB of an unimplemented user interrupt vector as shown in Figure 5-3. Reading this location returns whatever user data has been programmed at this location. Writing a zero to the COPR bit in this location clears the COP watchdog timer.
Address: $3FF0 BIt 7 6 X 5 X 4 X 3 X 2 X 1 X Bit 0 X COPR -- -- -- -- -- -- -- 0
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Read: Write: Reset:
X
= Unimplemented
Figure 5-3. COP Watchdog Timer Location
5.5.3 Illegal Address An illegal address reset is generated when the CPU attempts to fetch an instruction from I/O address space ($0000 to $001F).
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Section 6. Low-Power Modes
6.1 Contents
6.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Stop Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Low-Power Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
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6.3 6.4 6.5 6.6
6.2 Introduction
This section describes the low-power modes.
6.3 Stop Mode
The STOP instruction places the MCU in its lowest power-consumption mode. In stop mode, the internal oscillator is turned off, halting all internal processing, including timer operation. During stop mode, the CTCSR ($08) bits are altered to remove any pending timer interrupt request and to disable any further timer interrupts. The timer prescaler is cleared. The I bit in the CCR is cleared to enable external interrupts. All other registers and memory remain unaltered. All input/output lines remain unchanged.
NOTE:
The EIMSK bit is not cleared automatically by the execution of a STOP instruction. Care should be taken to clear this bit before entering stop mode.
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OSC11 tRL RESET
IRQ2
tLIH
IRQ3
tILCH
4064 tCYC
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INTERNAL CLOCK INTERNAL ADDRESS BUS
3FFE
3FFE
3FFE
3FFE
3FFF
NOTES: 1. Represents the internal gating of the OSC1 pin 2. IRQ pin edge-sensitive mask option 3. IRQ pin level and edge-sensitive mask option
RESET OR INTERRUPT VECTOR FETCH
Figure 6-1. Stop Recovery Timing Diagram
6.4 Stop Recovery
The processor can be brought out of stop mode only by an external interrupt, LPRST, or RESET. Refer to Figure 6-1.
NOTE:
If an external interrupt is pending when stop mode is entered, then stop mode will be exited immediately.
6.5 Wait Mode
The WAIT instruction places the MCU in a low power-consumption mode, but wait mode consumes more power than stop mode. All CPU action is suspended, but the core timer, the oscillator, and any enabled module remain active. Any interrupt or reset will cause the MCU to exit wait mode. The user must shut off subsystems to reduce power
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Low-Power Modes Low-Power Reset
consumption. Wait current specifications assume CPU operation only and do not include current consumption by any other subsystems. During wait mode, the I bit in the CCR is cleared to enable interrupts. All other registers, memory, and input/output lines remain in their previous states. The timer may be enabled to allow a periodic exit from wait mode.
6.6 Low-Power Reset
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Low-power reset mode is entered when a logic 0 is detected on the LPRST pin. When in this mode (as long as LPRST is held low), the MCU is held in reset and all internal clocks are halted. Applying a logic 1 to LPRST will cause the part to exit low-power reset mode and begin counting out the 4064-cycle oscillator stabilization period. Once this time has elapsed, the MCU will begin operation from the reset vectors ($3FFE-$3FFF).
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Freescale Semiconductor, Inc. Low-Power Modes
STOP
WAIT
STOP OSCILLATOR AND ALL CLOCKS. CLEAR I BIT.
OSCILLATOR ACTIVE. IR TIMER CLOCK ACTIVE. CORE TIMER CLOCK ACTIVE. PROCESSOR CLOCKS STOPPED.
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N
RESET OR LPRST Y
RESET OR LPRST Y
N
N
EXTERNAL INTERRUPT (PTB KEYSCAN PULLUPS) (IRQ) Y
EXTERNAL INTERRUPT N (PTB KEYSCAN PULLUPS) (IRQ) Y IR TIMER INTERNAL Y INTERRUPT Y
N
TURN ON OSCILLATOR. WAIT FOR TIME DELAY TO STABILIZE.
RESTART PROCESSOR CLOCK.
CORE TIMER INTERNAL INTERRUPT Y
N
1. FETCH RESET VECTOR OR 2. SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE
1. FETCH RESET VECTOR OR 2. SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE
Figure 6-2. Stop/Wait Flowchart
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Section 7. Parallel Input/Output (I/O)
7.1 Contents
7.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Input/Output Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
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7.3 7.4 7.5 7.6
7.2 Introduction
In user mode, 20 lines (in 28-pin PDIP or SOIC) or 24 lines (in 44-lead PLCC) are arranged as three 8-bit I/O ports. These ports are programmable as either inputs or outputs under software control of the data direction registers.
NOTE:
To avoid a glitch on the output pins, write data to the I/O port data register before writing a one to the corresponding data direction register.
7.3 Port A
Port A is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The port A data register is at $0000 and the data direction register (DDR) is at $0004. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a one to a DDR bit sets the corresponding port bit to output mode.
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Freescale Semiconductor, Inc. Parallel Input/Output (I/O) 7.4 Port B
Port B is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The address of the port B data register is $0001 and the data direction register (DDR) is at address $0005. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a one to a DDR bit sets the corresponding port bit to output mode. Each of the port B pins has a mask programmable pullup device that can be enabled. When the pullup device is enabled, this pin will become an interrupt pin also. The edge or edge and level sensitivity of the IRQ pin also will pertain to the enabled port B pins. Care needs to be taken when using port B pins that have the pullup enabled. Before switching from an output to an input, the data should be preconditioned to a logic one or the I bit should be set in the condition code register to prevent an interrupt from occurring. The EIMSK bit in the CMT MCSR register can be used to mask port B keyscan and external interrupts (IRQ).
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NOTE:
When a port B pin is configured as an output, it's corresponding keyscan interrupt is disabled, regardless of it's mask option.
VDD VDD DISABLED MASK OPTION (PB7PU) DDR BIT ENABLED PB7 NORMAL PORT CIRCUITRY AS SHOWN IN FIGURE 7-2 IRQEN IRQ TO INTERRUPT LOGIC
FROM ALL OTHER PORT B PINS
Figure 7-1. Port B Pullup Option
7.5 Port C
Port C is an 8-bit bidirectional port (PC0-PC7) which does not share any of its pins with other subsystems. The port C data register is at $0003 and the data direction register (DDR) is at $0006. Reset does not affect the data register, but clears the data direction register, thereby returning
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Parallel Input/Output (I/O) Input/Output Programming
the ports to inputs. Writing a one to a DDR bit sets the corresponding port bit to output mode. Port C pins PC4-PC7 are available only with the 44-lead PLCC package.
NOTE:
Only four bits of port C are bonded out in 28-pin packages for the MC68HC05RC16, although port C is truly an 8-bit port. Since pins PC4-PC7 are unbonded, software should include the code to set their respective data direction register locations to outputs to avoid floating inputs.
Freescale Semiconductor, Inc...
7.6 Input/Output Programming
Port pins may be programmed as inputs or outputs under software control. The direction of the pins is determined by the state of the corresponding bit in the port data direction register (DDR). Each I/O port has an associated DDR. Any I/O port pin is configured as an output if its corresponding DDR bit is set to a logic 1. A pin is configured as an input if its corresponding DDR bit is cleared to a logic 0. At power-on or reset, all DDRs are cleared, which configures all pins as inputs. The data direction registers are capable of being written to or read by the processor. During the programmed output state, a read of the data register actually reads the value of the output data latch and not the I/O pin. Table 7-1. I/O Pin Functions
Access Write Write Read Read DDR 0 1 0 1 I/O Pin Functions The I/O pin is in input mode. Data is written into the output data latch. Data is written into the output data latch and output to the I/O pin. The state of the I/O pin is read. The I/O pin is in an output mode. The output data latch is read.
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Freescale Semiconductor, Inc. Parallel Input/Output (I/O)
DATA DIRECTION REGISTER BIT INTERNAL HC05 CONNECTIONS
LATCHED OUTPUT DATA BIT
OUTPUT
I/O PIN
INPUT REG BIT INPUT I/O
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Figure 7-2. I/O Circuitry
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General Release Specification -- MC68HC05RC16
Section 8. Core Timer
8.1 Contents
8.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Core Timer Control and Status Register. . . . . . . . . . . . . . . . . .63 Core Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . .65 Computer Operating Properly (COP) Reset . . . . . . . . . . . . . . .66 Timer During Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
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8.3 8.4 8.5 8.6
8.2 Introduction
The core timer for this device is a 14-stage multifunctional ripple counter. Features include timer overflow, power-on reset (POR), real-time interrupt (RTI), and COP watchdog timer. As seen in Figure 8-1, the internal peripheral clock is divided by four, and then drives an 8-bit ripple counter. The value of this 8-bit ripple counter can be read by the CPU at any time by accessing the core timer counter register (CTCR) at address $09. A timer overflow function is implemented on the last stage of this counter, giving a possible interrupt rate of the internal peripheral clock (E)/1024. This point is then followed by three more stages, with the resulting clock (E/4096) driving the real-time interrupt circuit (RTI). The RTI circuit consists of three divider stages with a one-of-four selector. The output of the RTI circuit is further divided by eight to drive the mask optional COP watchdog timer circuit. The RTI rate selector bits and the RTI and CTOF enable bits and flags are located in the timer control and status register at location $08.
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General Release Specification
Freescale Semiconductor, Inc. Core Timer
INTERNAL BUS COP CLEAR
8
8 CTCR $09 CORE TIMER COUNTER REGISTER (CTCR)
INTERNAL PERIPHERAL CLOCK (E) E / 22
E / 210
/4
E / 212
POR
5-BIT COUNTER
Freescale Semiconductor, Inc...
E / 215 E / 214 E / 213 E / 212
TCBP
RTI SELECT CIRCUIT
OVERFLOW DETECT CIRCUIT RTIOUT CTCSR CTOF RTIF TOFE RTIE TOFC RTFC RT1 RT0 TIMER CONTROL & $08 STATUS REGISTER
INTERRUPT CIRCUIT
COP WATCHDOG TIMER (/8) 23
TO INTERRUPT LOGIC
TO RESET LOGIC
Figure 8-1. Core Timer Block Diagram
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Core Timer Core Timer Control and Status Register
8.3 Core Timer Control and Status Register
The CTCSR contains the timer interrupt flag, the timer interrupt enable bits, and the real-time interrupt rate select bits. Figure 8-2 shows the value of each bit in the CTCSR when coming out of reset.
Address: Read: Write: $08 CTOF RTIF TOFE RTIE TOFC 0 0 0 0 0 RTFC 0 1 1 0 0 RT1 RT0
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Reset:
= Unimplemented
Figure 8-2. Core Timer Control and Status Register (CTCSR) CTOF -- Core Timer Overflow CTOF is a read-only status bit set when the 8-bit ripple counter rolls over from $FF to $00. Clearing the CTOF is done by writing a one to TOFC. Writing to this bit has no effect. Reset clears CTOF. RTIF -- Real-Time Interrupt Flag The real-time interrupt circuit consists of a 3-stage divider and a one-of-four selector. The clock frequency that drives the RTI circuit is E/212 (or E / 4096 with three additional divider stages giving a maximum interrupt period of 16 milliseconds at a bus rate of 2.024 MHz. RTIF is a clearable, read-only status bit and is set when the output of the chosen (one-of-four selection) stage goes active. Clearing the RTIF is done by writing a one to RTFC. Writing has no effect on this bit. Reset clears RTIF. TOFE -- Timer Overflow Enable When this bit is set, a CPU interrupt request is generated when the CTOF bit is set. Reset clears this bit. RTIE -- Real-Time Interrupt Enable When this bit is set, a CPU interrupt request is generated when the RTIF bit is set. Reset clears this bit.
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General Release Specification
Freescale Semiconductor, Inc. Core Timer
TOFC -- Timer Overflow Flag Clear When a one is written to this bit, CTOF is cleared. Writing a zero has no effect on the CTOF bit. This bit always reads as zero. RTFC -- Real-Time Interrupt Flag Clear When a one is written to this bit, RTIF is cleared. Writing a zero has no effect on the RTIF bit. This bit always reads as zero. RT1-RT0 -- Real-Time Interrupt Rate Select
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These two bits select one of four taps from the real-time interrupt circuit. Refer to Table 8-1. Reset sets these two bits which selects the lowest periodic rate and gives the maximum time in which to alter these bits if necessary. Care should be taken when altering RT0 and RT1 if the timeout period is imminent or uncertain. If the selected tap is modified during a cycle in which the counter is switching, an RTIF could be missed or an additional one could be generated. To avoid problems, the COP should be cleared before changing RTI taps. Table 8-1. RTI and COP Rates at 4.096 MHz Oscillator
RTI RATE 2.048-MHz Bus
2 ms 4 ms 8 ms 16 ms
RT1:RT0
00 01 10 11
MINIMUM COP RATES 2.048-MHz Bus (215-212)/E (216-213)/E (217-214)/E (218-215)/E
14 ms 28 ms 56 ms 112 ms
212 / E 213 / E 214 / E 215 / E
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Core Timer Core Timer Counter Register
8.4 Core Timer Counter Register
The timer counter register is a read-only register that contains the current value of the 8-bit ripple counter at the beginning of the timer chain. This counter is clocked by the CPU clock (E/4) and can be used for various functions, including a software input capture. Extended time periods can be attained using the TOF function to increment a temporary RAM storage location, thereby simulating a 16-bit (or more) counter.
Address: Read: Write: Reset: 0 0 0 0 0 0 1 1 $09 D7 D6 D5 D4 D3 D2 D1 D0
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= Unimplemented
Figure 8-3. Core Timer Counter Register (CTCR) The power-on cycle clears the entire counter chain and begins clocking the counter. After 4064 cycles, the power-on reset circuit is released, which again clears the counter chain and allows the device to come out of reset. At this point, if RESET is not asserted, the timer starts counting up from zero and normal device operation begins. When RESET is asserted any time during operation (other than POR and low-power reset), the counter chain is cleared.
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General Release Specification
Freescale Semiconductor, Inc. Core Timer 8.5 Computer Operating Properly (COP) Reset
The COP watchdog timer function is implemented on this device by using the output of the RTI circuit and further dividing it by eight. The minimum COP reset rates are listed in Table 8-1. If the COP circuit times out, an internal reset is generated and the normal reset vector is fetched. Preventing a COP timeout, or clearing the COP is accomplished by writing a zero to bit 0 of address $3FF0. When the COP is cleared, only the final divide-by-eight stage (output of the RTI) is cleared.
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If the COP watchdog timer is allowed to time out, an internal reset is generated to reset the MCU. The COP remains enabled after execution of the WAIT instruction and all associated operations apply. If the STOP instruction is disabled, execution of STOP instruction causes the CPU to execute a WAIT instruction. In addition, the COP is prohibited from being held in reset. This prevents a device lock-up condition. This COP's objective is to make it impossible for this device to become stuck or locked-up and to be sure the COP is able to rescue the part from any situation where it might entrap itself in abnormal or unintended behavior. This function is a mask option.
8.6 Timer During Wait Mode
The CPU clock halts during wait mode, but the timer remains active. If interrupts are enabled, a timer interrupt will cause the processor to exit wait mode. The COP is always enabled while in user mode.
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General Release Specification -- MC68HC05RC16
Section 9. Carrier Modulator Transmitter (CMT)
9.1 Contents
9.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Freescale Semiconductor, Inc...
9.3
9.4 Carrier Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 9.4.1 Time Counter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71 9.4.2 Carrier Generator Data Registers (CHR1, CLR1, CHR2, and CLR2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 9.5 Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74 9.5.1 Time Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 9.5.2 FSK Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 9.5.3 Extended Space Operation . . . . . . . . . . . . . . . . . . . . . . . . .78 9.5.3.1 End Of Cycle (EOC) Interrupt . . . . . . . . . . . . . . . . . . . . .79 9.5.3.2 Modulator Control and Status Register (MCSR) . . . . . . .80 9.5.4 Modulator Period Data Registers (MDR1, MDR2, and MDR3) . . . . . . . . . . . . . . . . . . . . . .83
9.2 Introduction
The carrier modulator transmitter (CMT) module provides a means to generate the protocol timing and carrier signals for a wide variety of encoding schemes. It incorporates hardware to off-load the critical and/or lengthy timing requirements associated with code generation from the CPU, releasing much of its bandwidth to handle other tasks such as code data generation, data decompression, or keyboard scanning. The CMT does not include dedicated hardware configurations for specific protocols, but is intended to be sufficiently programmable in its function to handle the timing requirements of most protocols with minimal CPU intervention. When disabled, certain CMT registers can be
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT)
used to change the state of the infrared out pin (IRO) directly. This feature allows for the generation of future protocols not readily producible by the current architecture.
9.3 Overview
The module consists of carrier generator, modulator, and transmitter output blocks. The block diagram is shown in Figure 9-1. The carrier generator has a resolution of 500 ns with a 2-MHz oscillator. The user may independently define the high and low times of the carrier signal to determine both period and duty cycle. The carrier generator can generate signals with periods between 1 s (1 MHz) and 64 s (15.6 kHz) in steps of 500 ns. The possible duty cycle options will depend upon the number of counts required to complete the carrier period. For example, a 400-kHz signal has a period of 2.5 s and will therefore require 5 x 500 ns counts to generate. These counts may be split between high and low times so the duty cycles available will be 20% (one high, four low), 40% (two high, three low), 60% (three high, two low) and 80% (four high, one low). For lower frequency signals with larger periods, higher resolution (as a percentage of the total period) duty cycles are possible. The carrier generator may select between two sets of high and low times. When operating in normal mode (subsequently referred to as time mode), just one set will be used. When operating in FSK (frequency shift key) mode, the generator will toggle between the two sets when instructed to do so by the modulator, allowing the user to dynamically switch between two carrier frequencies without CPU intervention. When the BASE bit in the modulator control and status register (MCSR) is set, the carrier output to the modulator is held high continuously to allow for the generation of baseband protocols. See 9.4 Carrier Generator.
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MC68HC05RC16 -- Rev. 3.0
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Carrier Modulator Transmitter (CMT) Overview
PRIMARY/SECONDARY SELECT MODE BASE
fOSC
.
CARRIER GENERATOR
CARRIER OUT
MODULATOR OUT MODULATOR
TRANSMITTER OUTPUT
IRO PIN
Freescale Semiconductor, Inc...
fOSC / 2
CPU INTERFACE
DB
AB
EOC INTERRUPT
Figure 9-1. Carrier Modulator Transmitter Module Block Diagram The modulator provides a simple method to control protocol timing. The modulator has a resolution of 4 s with a 2-MHz oscillator. It can count system clocks to provide real-time control or it can count carrier clocks for self-clocked protocols. It can either gate the carrier onto the modulator output (TIME), control the logic level of the modulator output (baseband) or directly route the carrier to the modulator output while providing a signal to switch the carrier generator between high/low time register buffers (FSK). See 9.5 Modulator. The transmitter output block controls the state of the infrared out pin (IRO). The modulator output is gated on to the IRO pin when the modulator/carrier generator is enabled. Otherwise, the IRO pin is controlled by the state of the IRO latch, which is directly accessible to the CPU by means of bit 7 of the carrier generator data registers CHR1 and CLR1. The IRO latch can be written to on either edge of the internal bus clock (fosc/2), allowing for IR waveforms which have a resolution of twice the bus clock frequency (fosc). See 9.4.2 Carrier Generator Data Registers (CHR1, CLR1, CHR2, and CLR2).
MC68HC05RC16 -- Rev. 3.0 Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com General Release Specification
EOC INTERRUPT ENABLE
EOC FLAG
MODULATOR/ CARRIER ENABLE
Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) 9.4 Carrier Generator
The carrier signal is generated by counting a predetermined number of input clocks (500 ns for a 2-MHz oscillator) for both the carrier high time and the carrier low time. The period is determined by the total number of clocks counted. The duty cycle is determined by the ratio of high time clocks to total clocks counted. The high and low time values are user programmable and are held in two registers. An alternate set of high/low count values is held in another set of registers to allow the generation of dual frequency FSK (frequency shift keying) protocols without CPU intervention. The MCGEN bit in the MCSR must be set and the BASE bit in the MCSR must be cleared to enable carrier generator clocks. The block diagram is shown in Figure 9-2.
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SECONDARY HIGH COUNT REGISTER PRIMARY HIGH COUNT REGISTER
COUNT REGISTER SELECT CONTROL
=? fOSC CLOCK AND OUTPUT CONTROL
MODE
BASE MODULATOR/ CARRIER GENERATOR ENABLE
CLK CLR
6-BIT UP COUNTER
PRIMARY/ SECONDARY SELECT
CARRIER OUT
=?
SECONDARY LOW COUNT REGISTER PRIMARY LOW COUNT REGISTER
Figure 9-2. Carrier Generator Block Diagram
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Carrier Modulator Transmitter (CMT) Carrier Generator
9.4.1 Time Counter The high/low time counter is a 6-bit up counter. After each increment, the contents of the counter are compared with the appropriate high or low count value register. When this value is reached, the counter is reset and the compare is redirected to the other count value register. Assuming that the high time count compare register is currently active, a valid compare will cause the carrier output to be driven low. The counter will continue to increment and when reaching the value stored in the selected low count value register, it will be cleared and will cause the carrier output to be driven high. The cycle repeats, automatically generating a periodic signal which is directed to the modulator. The lowest frequency (maximum period) and highest frequency (minimum period) which can be generated are defined below. fmin = fosc / (2 x (26 - 1)) Hz fmax = fosc / (2 x 1) Hz In the general case, the carrier generator output frequency is: fout = fosc / (Highcount + Lowcount) Hz Where: 0 < Highcount < 64 and 0 < Lowcount < 64
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NOTE:
These equations assume the DIV2 bit (bit 6) of the MCSR is clear. When the DIV2 bit is set, the carrier generator frequency will be half of what is shown in these equations.
The duty cycle of the carrier signal is controlled by varying the ratio of high time to low + high time. As the input clock period is fixed, the duty cycle resolution will be proportional to the number of counts required to generate the desired carrier period.
Highcount Duty Cycle = --------------------------------------------------------------Highcount + Lowcount
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9.4.2 Carrier Generator Data Registers (CHR1, CLR1, CHR2, and CLR2) The carrier generator contains two, 7-bit data registers: primary high time (CHR1), primary low time (CLR1); and two, 6-bit data registers: secondary high time (CHR2) and secondary low time (CLR2). Bit 7 of CHR1 and CHR2 is used to read and write the IRO latch.
Address: $0010 Bit 7 6 0 0 5 PH5 U 4 PH4 U 3 PH3 U 2 PH2 U 1 PH1 U Bit 0 PH0 U
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Read: IROLN Write: Reset: 0 U = Unaffected
Figure 9-3. Carrier Generator Data Register CHR1
Address:
$0011 Bit 7 6 0 0 5 PL5 U 4 PL4 U 3 PL3 U 2 PL2 U 1 PL1 U Bit 0 PL0 U
Read: IROLP Write: Reset: 0 U = Unaffected
Figure 9-4. Carrier Generator Data Register CLR1
Address:
$0012 Bit 7 6 0 0 5 SH5 U 4 SH4 U 3 SH3 U 2 SH2 U 1 SH1 U Bit 0 SH0 U
Read: 0 Write: Reset: 0 U = Unaffected
Figure 9-5. Carrier Generator Data Register CHR2
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Carrier Modulator Transmitter (CMT) Carrier Generator
Address:
$0013 Bit 7 6 0 0 5 SL5 U 4 SL4 U 3 SL3 U 2 SL2 U 1 SL1 U Bit 0 SL0 U
Read: 0 Write: Reset: 0 U = Unaffected
Freescale Semiconductor, Inc...
Figure 9-6. Carrier Generator Data Register CLR2 PH0-PH5 and PL0-PL5 -- Primary Carrier High and Low Time Data Values When selected, these bits contain the number of input clocks required to generate the carrier high and low time periods. When operating in time mode (see 9.5.1 Time Mode), this register pair is always selected. When operating in FSK mode (see 9.5.2 FSK Mode), this register pair and the secondary register pair are alternately selected under control of the modulator. The primary carrier high and low time values are undefined out of reset. These bits must be written to nonzero values before the carrier generator is enabled to avoid spurious results.
NOTE:
Writing to CHR1 to update PH0-PH5 or to CLR1 to update PL0-PL5 will also update the IRO latch. When MCGEN (bit 0 in the MCSR) is clear, the IRO latch value appears on the IRO output pin. Care should be taken that bit 7 of the data to be written to CHR1 or CHL1 should contain the desired state of the IRO latch.
SH0-SH5 and SL0-SL5 -- Secondary Carrier High and Low Time Data Values When selected, these bits contain the number of input clocks required to generate the carrier high and low time periods. When operating in time mode (see 9.5.1 Time Mode), this register pair is never selected. When operating in FSK mode (see 9.5.2 FSK Mode), this register pair and the secondary register pair are alternately selected under control
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT)
of the modulator. The secondary carrier high and low time values are undefined out of reset. These bits must be written to nonzero values before the carrier generator is enabled when operating in FSK mode. IROLN and IROLP -- IRO Latch Control Reading IROLN or IROLP reads the state of the IRO latch. Writing IROLN updates the IRO latch with the data being written on the negative edge of the internal processor clock (fosc/2). Writing IROLP
Freescale Semiconductor, Inc...
updates the IRO latch on the positive edge of the internal processor clock; for example, one fosc period later. The IRO latch is clear out of reset.
NOTE:
Writing to CHR1 to update IROLN or to CLR1 to update IROLP will also update the primary carrier high and low data values. Care should be taken that bits 5-0 of the data to be written to CHR1 or CHL1 should contain the desired values for the primary carrier high or low data.
9.5 Modulator
The modulator consists of a 12-bit down counter with underflow detection which is loaded from the modulation mark period from the mark buffer register, MBUFF. When this counter underflows, the modulator gate is closed and a 12-bit comparator is enabled which continually compares the logical complement of the contents of the (still) decrementing counter with the contents of the modulation space period register, SREG. When a match is obtained, the modulator control gate is opened again. Should SREG = 0, the match will be immediate and no space period will be generated (for instance, for FSK protocols which require successive bursts of different frequencies). When the match occurs, the counter is reloaded with the contents of MBUFF, SREG is reloaded with the contents of its buffer, SBUFF, and the cycle repeats. The MCGEN bit in the MCSR must be set to enable the modulator timer. The 12-bit MBUFF and SBUFF registers are accessed through three 8-bit modulator period registers, MDR1, MDR2, and MDR3.
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Carrier Modulator Transmitter (CMT) Modulator
The modulator can operate in two modes, time or FSK. In time mode the modulator counts clocks derived from the system oscillator and modulates a single-carrier frequency or no carrier (baseband). In FSK mode, the modulator counts carrier periods and instructs the carrier generator to alternate between two carrier frequencies whenever a modulation period (mark + space counts) expires.
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12 BITS 0 MBUFF 8 CLOCK CONTROL 13-BIT DOWN COUNTER * COUNTER 12 LOAD MBUFF/SBUFF . MODULATOR GATE MODULATOR OUT . CARRIER OUT fOSC
MS BIT
=?
12 SREG *
SYSTEM CONTROL PRIMARY/SECONDARY SELECT EXTENDED SPACE EOC FLAG SET
MODULATOR/ CARRIER GENERATOR. ENABLE EOC FLAG
SBUFF 12 BITS MODULATOR CONTROL/STATUS REGISTER
EOC INTERRUPT ENABLE MODE BASE
* DENOTES HIDDEN REGISTER
DIV2
Figure 9-7. Modulator Block Diagram
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT)
9.5.1 Time Mode When the modulator operates in time mode, the modulation mark and space periods consist of zero or an integer number of fosc / 8 clocks (= 250 kHz @ 2 MHz osc). This provides a modulator resolution of 4 s and a maximum mark and space periods of about 16 ms (each). However, to prevent carrier glitches which could affect carrier spectral purity, the modulator control gate and carrier clock are synchronized. The carrier signal is activated when the modulator gate opens. The modulator gate can only close when the carrier signal is low (the output logic level during space periods is low). If the carrier generator is in baseband mode (BASE bit in MCSR is high), the modulator output will be at a logic one for the duration of the mark period and at a logic zero for the duration of a space period. See Figure 9-8. The mark and space time equations are:
( MBUFF + 1 ) x 8 t mark = --------------------------------------------- sec s f osc SBUFF x 8 t space = ----------------------------- sec s f osc
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Setting the DIV2 bit in the MCSR will double mark and space times.
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Carrier Modulator Transmitter (CMT) Modulator
fOSC / 8
CARRIER FREQUENCY
MODULATOR GATE
MARK
SPACE
MARK
SPACE
MARK
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TIME MODE OUTPUT
BASEBAND OUTPUT
Figure 9-8. CMT Operation in Time Mode
9.5.2 FSK Mode When the modulator operates in FSK mode, the modulation mark and space periods consist of an integer number of carrier clocks (space period can be zero). When the mark period expires, the space period is transparently started (as in time mode); however, in FSK mode the carrier switches between data registers in preparation for the next mark period. The carrier generator toggles between primary and secondary data register values whenever the modulator mark period expires. The space period provides an interpulse gap (no carrier), but if SBUFF = 0, then the modulator and carrier generator will switch between carrier frequencies without a gap or any carrier glitches (zero space). Using timing data for carrier burst and interpulse gap length calculated by the CPU, FSK mode can automatically generate a phase-coherent, dual-frequency FSK signal with programmable burst and interburst gaps.
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT)
The mark and space time equations for FSK mode are: MBUFF + 1 t mark = ------------------------------- sec s fcg SBUFF t space = -------------------- sec s f cg Where fcg is the frequency output from the carrier generator, setting the DIV2 bit in the MCSR will double mark and space times.
Freescale Semiconductor, Inc...
9.5.3 Extended Space Operation In either time or FSK mode, the space period can be made longer than the maximum possible value of SBUFF. Setting the EXSPC bit in the MCSR will force the modulator to treat the next modulation period (beginning with the next load of MBUFF/SBUFF) as a space period equal in length to the mark and space counts combined. Subsequent modulation periods will consist entirely of these extended space periods with no mark periods. Clearing EXSPC will return the modulator to standard operation at the beginning of the next modulation period. To calculate the length of an extended space in time mode, use the equation:
texspace =
Where:
((SBUFF1)+(MBUFF2+1+SBUFF2) +... (MBUFFn+1+SBUFFn)) x 8
fosc
secs
the subscripts 1, 2, ... n refer to the modulation periods that elapsed while the EXSPC bit was set. Similarly, to calculate the length of an extended space in FSK mode, use the equation:
texspace =
((SBUFF1)+(MBUFF2+1+SBUFF2)+... (MBUFFn+1+SBUFFn)) fcg
secs
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Carrier Modulator Transmitter (CMT) Modulator
Where fcg is the frequency output from the carrier generator. For an example of extended space operation, see Figure 9-9.
NOTE:
The EXSPC feature can be used to emulate a zero mark event.
SET EXSPC
CLEAR EXSPC
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Figure 9-9. Extended Space Operation 9.5.3.1 End Of Cycle (EOC) Interrupt At the end of each cycle (when the counter is reloaded from MBUFF), the end of cycle (EOC) flag is set. If the interrupt enable bit was previously set, an interrupt also will be issued to the CPU. The EOC interrupt provides a means for the user to reload new mark/space values into the MBUFF and SBUFF registers. As the EOC interrupt is coincident with reloading the counter, MBUFF does not require additional buffering and may be updated with a new value for the next period from within the EOC interrupt service routine (ISR). To allow both mark and space period values to be updated from within the same ISR, SREG is buffered by SBUFF. The contents written to SBUFF are transferred to the active register SREG at the end of every cycle regardless of the state of the EOC flag. The EOC flag is cleared by a read of the modulator control and status register (MCSR) followed by an access of MDR2 or MDR3. The EOC flag must be cleared within the ISR to prevent another interrupt being generated after exiting the ISR. If the EOC interrupt is not being used (IE = 0), the EOC flag need not be cleared.
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9.5.3.2 Modulator Control and Status Register The modulator control and status register (MCSR) contains the modulator and carrier generator enable (MCGEN), interrupt enable (IE), mode select (MODE), baseband enable (BASE), extended space (EXSPC), and external interrupt mask (EIMSK) control bits, divide-by-two prescaler (DIV2) bit, and the end of cycle (EOC) status bit.
Address: $0014 Bit 7 Read: Write: Reset: 0 0 0 0 0 0 0 0 EOC DIV2 EIMSK EXSPC BASE MODE IE MCGEN 6 5 4 3 2 1 Bit 0
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Unimplemented
Figure 9-10. Modulator Control and Status Register (MCSR) EOC -- End Of Cycle Status Flag EOC is set when a match occurs between the contents of the space period register, SREG, and the down counter. This is recognized as the end of the modulation cycle. At this time, the counter is initialized with the (possibly new) contents of the mark period buffer, MBUFF, and the space period register, SREG, is loaded with the (possibly new) contents of the space period buffer, SBUFF. This flag is cleared by a read of the MCSR followed by an access of MDR2 or MDR3. The EOC flag is cleared by reset. 1 = End of modulator cycle (counter = SBUFF) has occurred 0 = Current modulation cycle in progress DIV2 -- Divide-by-two prescaler The divide-by-two prescaler causes the CMT to be clocked at the bus rate when enabled; 2 x the bus rate when disabled (fosc). This bit is not double buffered and so should not be set during a transmission. 1 = Divide-by-two prescaler enabled 0 = Divide-by-two prescaler disabled
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Carrier Modulator Transmitter (CMT) Modulator
EIMSK -- External Interrupt Mask The external interrupt mask bit is used to mask IRQ and keyscan interrupts. This bit is cleared by reset. 1 = IRQ and keyscan interrupts masked 0 = IRQ and keyscan interrupts enabled EXSPC -- Extended Space Enable For a description of the extended space enable bit, see 9.5.3 Extended Space Operation. This bit is cleared by reset. 1 = Extended space enabled 0 = Extended space disabled BASE -- Baseband Enable When set, the BASE bit disables the carrier generator and forces the carrier output high for generation of baseband protocols. When BASE is clear, the carrier generator is enabled and the carrier output toggles at the frequency determined by values stored in the carrier data registers. See 9.5.1 Time Mode. This bit is cleared by reset. This bit is not double buffered and should not be written to during a transmission. 1 = Baseband enabled 0 = Baseband disabled MODE -- Mode Select For a description of CMT operation in time mode, see 9.5.1 Time Mode. For a description of CMT operation in FSK mode, see 9.5.2 FSK Mode. This bit is cleared by reset. This bit is not double buffered and should not be written to during a transmission. 1 = CMT operates in FSK mode. 0 = CMT operates in time mode. IE -- Interrupt Enable A CPU interrupt will be requested when EOC is set if IE was previously set. If IE is clear, EOC will not request a CPU interrupt. 1 = CPU interrupt enabled 0 = CPU interrupt disabled
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT)
MCGEN -- Modulator and Carrier Generator Enable Setting MCGEN will initialize the carrier generator and modulator and will enable all clocks. Once enabled, the carrier generator and modulator will function continuously. When MCGEN is cleared, the current modulator cycle will be allowed to expire before all carrier and modulator clocks are disabled (to save power) and the modulator output is forced low. The user should initialize all data and control registers before enabling the system to prevent spurious operation. This bit is cleared by reset. 1 = Modulator and carrier generator enabled 0 = Modulator and carrier generator disabled
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Carrier Modulator Transmitter (CMT) Modulator
9.5.4 Modulator Period Data Registers (MDR1, MDR2, and MDR3) The 12-bit MBUFF and SBUFF registers are accessed through three 8-bit registers: MDR1, MDR2, and MDR3. MDR2 and MDR3 contain the least significant eight bits of MBUFF and SBUFF respectively. MDR1 contains the two most significant nibbles of MBUFF and SBUFF. In many applications, periods greater than those obtained by eight bits will not be required. Dividing the registers in this manner allows the user to clear MDR1 and generate 8-bit periods with just two data writes.
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Address:
$0015 Bit 7 6 MB10 5 MB9 4 MB8 3 SB11 2 SB10 1 SB9 Bit 0 SB8
Read: MB11 Write: Reset: Unaffected by Reset
Figure 9-11. Modulator Period Data Register MDR1
Address:
$0016 Bit 7 6 MB6 5 MB5 4 MB4 3 MB3 2 MB2 1 MB1 Bit 0 MB0
Read: MB7 Write: Reset: Unaffected by Reset
Figure 9-12. Modulator Period Data Register MDR2
Address:
$0017 Bit 7 6 SB6 5 SB5 4 SB4 3 SB3 2 SB2 1 SB1 Bit 0 SB0
Read: SB7 Write: Reset: Unaffected by Reset
Figure 9-13. Modulator Period Data Register MDR3
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General Release Specification -- MC68HC05RC16
Section 10. Instruction Set
10.1 Contents
10.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
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10.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86 10.3.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.4 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 10.3.5 Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 10.3.6 Indexed, 8-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 10.3.7 Indexed,16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 10.3.8 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89 10.4 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89 10.4.1 Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . .90 10.4.2 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .91 10.4.3 Jump/Branch Instructions . . . . . . . . . . . . . . . . . . . . . . . . . .92 10.4.4 Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . .94 10.4.5 Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 10.5 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
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Freescale Semiconductor, Inc. Instruction Set 10.2 Introduction
The MCU instruction set has 62 instructions and uses eight addressing modes. The instructions include all those of the M146805 CMOS Family plus one more: the unsigned multiply (MUL) instruction. The MUL instruction allows unsigned multiplication of the contents of the accumulator (A) and the index register (X). The high-order product is stored in the index register, and the low-order product is stored in the accumulator.
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10.3 Addressing Modes
The CPU uses eight addressing modes for flexibility in accessing data. The addressing modes provide eight different ways for the CPU to find the data required to execute an instruction. The eight addressing modes are: * * * * * * * * Inherent Immediate Direct Extended Indexed, no offset Indexed, 8-bit offset Indexed, 16-bit offset Relative
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Instruction Set Addressing Modes
10.3.1 Inherent Inherent instructions are those that have no operand, such as return from interrupt (RTI) and stop (STOP). Some of the inherent instructions act on data in the CPU registers, such as set carry flag (SEC) and increment accumulator (INCA). Inherent instructions require no operand address and are one byte long.
10.3.2 Immediate
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Immediate instructions are those that contain a value to be used in an operation with the value in the accumulator or index register. Immediate instructions require no operand address and are two bytes long. The opcode is the first byte, and the immediate data value is the second byte.
10.3.3 Direct Direct instructions can access any of the first 256 memory locations with two bytes. The first byte is the opcode, and the second is the low byte of the operand address. In direct addressing, the CPU automatically uses $00 as the high byte of the operand address.
10.3.4 Extended Extended instructions use three bytes and can access any address in memory. The first byte is the opcode; the second and third bytes are the high and low bytes of the operand address. When using the Motorola assembler, the programmer does not need to specify whether an instruction is direct or extended. The assembler automatically selects the shortest form of the instruction.
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10.3.5 Indexed, No Offset Indexed instructions with no offset are 1-byte instructions that can access data with variable addresses within the first 256 memory locations. The index register contains the low byte of the effective address of the operand. The CPU automatically uses $00 as the high byte, so these instructions can address locations $0000-$00FF. Indexed, no offset instructions are often used to move a pointer through a table or to hold the address of a frequently used RAM or I/O location.
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10.3.6 Indexed, 8-Bit Offset Indexed, 8-bit offset instructions are 2-byte instructions that can access data with variable addresses within the first 511 memory locations. The CPU adds the unsigned byte in the index register to the unsigned byte following the opcode. The sum is the effective address of the operand. These instructions can access locations $0000-$01FE. Indexed 8-bit offset instructions are useful for selecting the kth element in an n-element table. The table can begin anywhere within the first 256 memory locations and could extend as far as location 510 ($01FE). The k value is typically in the index register, and the address of the beginning of the table is in the byte following the opcode.
10.3.7 Indexed,16-Bit Offset Indexed, 16-bit offset instructions are 3-byte instructions that can access data with variable addresses at any location in memory. The CPU adds the unsigned byte in the index register to the two unsigned bytes following the opcode. The sum is the effective address of the operand. The first byte after the opcode is the high byte of the 16-bit offset; the second byte is the low byte of the offset. Indexed, 16-bit offset instructions are useful for selecting the kth element in an n-element table anywhere in memory. As with direct and extended addressing, the Motorola assembler determines the shortest form of indexed addressing.
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Instruction Set Instruction Types
10.3.8 Relative Relative addressing is only for branch instructions. If the branch condition is true, the CPU finds the effective branch destination by adding the signed byte following the opcode to the contents of the program counter. If the branch condition is not true, the CPU goes to the next instruction. The offset is a signed, two's complement byte that gives a branching range of -128 to +127 bytes from the address of the next location after the branch instruction.
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When using the Motorola assembler, the programmer does not need to calculate the offset, because the assembler determines the proper offset and verifies that it is within the span of the branch.
10.4 Instruction Types
The MCU instructions fall into the following five categories: * * * * * Register/Memory Instructions Read-Modify-Write Instructions Jump/Branch Instructions Bit Manipulation Instructions Control Instructions
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10.4.1 Register/Memory Instructions These instructions operate on CPU registers and memory locations. Most of them use two operands. One operand is in either the accumulator or the index register. The CPU finds the other operand in memory. Table 10-1. Register/Memory Instructions
Instruction Mnemonic ADC ADD AND BIT CMP CPX EOR LDA LDX MUL ORA SBC STA STX SUB
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Add Memory Byte and Carry Bit to Accumulator Add Memory Byte to Accumulator AND Memory Byte with Accumulator Bit Test Accumulator Compare Accumulator Compare Index Register with Memory Byte EXCLUSIVE OR Accumulator with Memory Byte Load Accumulator with Memory Byte Load Index Register with Memory Byte Multiply OR Accumulator with Memory Byte Subtract Memory Byte and Carry Bit from Accumulator Store Accumulator in Memory Store Index Register in Memory Subtract Memory Byte from Accumulator
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Instruction Set Instruction Types
10.4.2 Read-Modify-Write Instructions These instructions read a memory location or a register, modify its contents, and write the modified value back to the memory location or to the register.
NOTE:
Do not use read-modify-write operations on write-only registers.
Table 10-2. Read-Modify-Write Instructions
Instruction Mnemonic ASL ASR BCLR(1) BSET(1) CLR COM DEC INC LSL LSR NEG ROL ROR TST(2)
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Arithmetic Shift Left (Same as LSL) Arithmetic Shift Right Bit Clear Bit Set Clear Register Complement (One's Complement) Decrement Increment Logical Shift Left (Same as ASL) Logical Shift Right Negate (Two's Complement) Rotate Left through Carry Bit Rotate Right through Carry Bit Test for Negative or Zero
1. Unlike other read-modify-write instructions, BCLR and BSET use only direct addressing. 2. TST is an exception to the read-modify-write sequence because it does not write a replacement value.
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10.4.3 Jump/Branch Instructions Jump instructions allow the CPU to interrupt the normal sequence of the program counter. The unconditional jump instruction (JMP) and the jump-to-subroutine instruction (JSR) have no register operand. Branch instructions allow the CPU to interrupt the normal sequence of the program counter when a test condition is met. If the test condition is not met, the branch is not performed. The BRCLR and BRSET instructions cause a branch based on the state of any readable bit in the first 256 memory locations. These 3-byte instructions use a combination of direct addressing and relative addressing. The direct address of the byte to be tested is in the byte following the opcode. The third byte is the signed offset byte. The CPU finds the effective branch destination by adding the third byte to the program counter if the specified bit tests true. The bit to be tested and its condition (set or clear) is part of the opcode. The span of branching is from -128 to +127 from the address of the next location after the branch instruction. The CPU also transfers the tested bit to the carry/borrow bit of the condition code register.
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Instruction Set Instruction Types
Table 10-3. Jump and Branch Instructions
Instruction Branch if Carry Bit Clear Branch if Carry Bit Set Branch if Equal Branch if Half-Carry Bit Clear Branch if Half-Carry Bit Set Branch if Higher Mnemonic BCC BCS BEQ BHCC BHCS BHI BHS BIH BIL BLO BLS BMC BMI BMS BNE BPL BRA BRCLR BRN BRSET BSR JMP JSR
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Branch if Higher or Same Branch if IRQ Pin High Branch if IRQ Pin Low Branch if Lower Branch if Lower or Same Branch if Interrupt Mask Clear Branch if Minus Branch if Interrupt Mask Set Branch if Not Equal Branch if Plus Branch Always Branch if Bit Clear Branch Never Branch if Bit Set Branch to Subroutine Unconditional Jump Jump to Subroutine
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10.4.4 Bit Manipulation Instructions The CPU can set or clear any writable bit in the first 256 bytes of memory, which includes I/O registers and on-chip RAM locations. The CPU can also test and branch based on the state of any bit in any of the first 256 memory locations. Table 10-4. Bit Manipulation Instructions
Instruction Mnemonic BCLR BRCLR BRSET BSET
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Bit Clear Branch if Bit Clear Branch if Bit Set Bit Set
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Instruction Set Instruction Types
10.4.5 Control Instructions These instructions act on CPU registers and control CPU operation during program execution. Table 10-5. Control Instructions
Instruction Clear Carry Bit Clear Interrupt Mask Mnemonic CLC CLI NOP RSP RTI RTS SEC SEI STOP SWI TAX TXA
WAIT
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No Operation Reset Stack Pointer Return from Interrupt Return from Subroutine Set Carry Bit Set Interrupt Mask Stop Oscillator and Enable IRQ Pin Software Interrupt Transfer Accumulator to Index Register Transfer Index Register to Accumulator Stop CPU Clock and Enable Interrupts
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Freescale Semiconductor, Inc. Instruction Set 10.5 Instruction Set Summary
Table 10-6. Instruction Set Summary
Opcode Source Form
ADC #opr ADC opr ADC opr ADC opr,X ADC opr,X ADC ,X ADD #opr ADD opr ADD opr ADD opr,X ADD opr,X ADD ,X AND #opr AND opr AND opr AND opr,X AND opr,X AND ,X ASL opr ASLA ASLX ASL opr,X ASL ,X ASR opr ASRA ASRX ASR opr,X ASR ,X BCC rel
Operation
Description
H I NZC
Add with Carry
A (A) + (M) + (C)
--
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IMM DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX DIR INH INH IX1 IX REL
ii A9 2 B9 dd 3 C9 hh ll 4 D9 ee ff 5 E9 ff 4 F9 3 AB ii 2 BB dd 3 CB hh ll 4 DB ee ff 5 EB ff 4 FB 3 ii A4 2 B4 dd 3 C4 hh ll 4 D4 ee ff 5 E4 ff 4 F4 3 38 48 58 68 78 37 47 57 67 77 24 11 13 15 17 19 1B 1D 1F 25 27 28 29 22 24 dd 5 3 3 6 5 5 3 3 6 5 3 5 5 5 5 5 5 5 5 3 3 3 3 3 3
Add without Carry
A (A) + (M)
--
Logical AND
A (A) (M)
----
--
Arithmetic Shift Left (Same as LSL)
C b7 b0
0
----
ff dd
Arithmetic Shift Right
b7 b0
C
----
ff rr dd dd dd dd dd dd dd dd rr rr rr rr rr rr
Branch if Carry Bit Clear
PC (PC) + 2 + rel ? C = 0
----------
BCLR n opr
Clear Bit n
Mn 0
DIR (b0) DIR (b1) DIR (b2) DIR (b3) ---------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) ---------- ---------- ---------- ---------- ---------- ---------- REL REL REL REL REL REL
BCS rel BEQ rel BHCC rel BHCS rel BHI rel BHS rel
Branch if Carry Bit Set (Same as BLO) Branch if Equal Branch if Half-Carry Bit Clear Branch if Half-Carry Bit Set Branch if Higher Branch if Higher or Same
PC (PC) + 2 + rel ? C = 1 PC (PC) + 2 + rel ? Z = 1 PC (PC) + 2 + rel ? H = 0 PC (PC) + 2 + rel ? H = 1 PC (PC) + 2 + rel ? C Z = 0 PC (PC) + 2 + rel ? C = 0
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Cycles
Effect on CCR
Operand
Address Mode
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Instruction Set Instruction Set Summary
Table 10-6. Instruction Set Summary (Continued)
Opcode Source Form
BIH rel BIL rel BIT #opr BIT opr BIT opr BIT opr,X BIT opr,X BIT ,X BLO rel BLS rel BMC rel BMI rel BMS rel BNE rel BPL rel BRA rel
Operation
Branch if IRQ Pin High Branch if IRQ Pin Low
Description
PC (PC) + 2 + rel ? IRQ = 1 PC (PC) + 2 + rel ? IRQ = 0
H I NZC
---------- ----------
REL REL IMM DIR EXT IX2 IX1 IX REL REL REL REL REL REL REL REL
2F 2E A5 B5 C5 D5 E5 F5 25 23 2C 2B 2D 26 2A 20 01 03 05 07 09 0B 0D 0F 21 00 02 04 06 08 0A 0C 0E 10 12 14 16 18 1A 1C 1E
rr rr ii dd hh ll ee ff ff rr rr rr rr rr rr rr rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd dd dd dd dd dd dd dd
Bit Test Accumulator with Memory Byte
(A) (M)
----
--
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Branch if Lower (Same as BCS) Branch if Lower or Same Branch if Interrupt Mask Clear Branch if Minus Branch if Interrupt Mask Set Branch if Not Equal Branch if Plus Branch Always
PC (PC) + 2 + rel ? C = 1 PC (PC) + 2 + rel ? C Z = 1 PC (PC) + 2 + rel ? I = 0 PC (PC) + 2 + rel ? N = 1 PC (PC) + 2 + rel ? I = 1 PC (PC) + 2 + rel ? Z = 0 PC (PC) + 2 + rel ? N = 0 PC (PC) + 2 + rel ? 1 = 1
---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------
BRCLR n opr rel Branch if Bit n Clear
PC (PC) + 2 + rel ? Mn = 0
DIR (b0) DIR (b1) DIR (b2) DIR (b3) -------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) ---------- REL
BRN rel
Branch Never
PC (PC) + 2 + rel ? 1 = 0
BRSET n opr rel Branch if Bit n Set
PC (PC) + 2 + rel ? Mn = 1
DIR (b0) DIR (b1) DIR (b2) DIR (b3) -------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) DIR (b0) DIR (b1) DIR (b2) DIR (b3) ---------- DIR (b4) DIR (b5) DIR (b6) DIR (b7)
BSET n opr
Set Bit n
Mn 1
BSR rel
Branch to Subroutine
PC (PC) + 2; push (PCL) SP (SP) - 1; push (PCH) SP (SP) - 1 PC (PC) + rel C0 I0
----------
REL
AD
rr
CLC CLI
Clear Carry Bit Clear Interrupt Mask
-------- 0 -- 0 ------
INH INH
98 9A
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Cycles
3 3 2 3 4 5 4 3 3 3 3 3 3 3 3 3 5 5 5 5 5 5 5 5 3 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 6 2 2
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc. Instruction Set
Table 10-6. Instruction Set Summary (Continued)
Opcode Source Form
CLR opr CLRA CLRX CLR opr,X CLR ,X CMP #opr CMP opr CMP opr CMP opr,X CMP opr,X CMP ,X COM opr COMA COMX COM opr,X COM ,X CPX #opr CPX opr CPX opr CPX opr,X CPX opr,X CPX ,X DEC opr DECA DECX DEC opr,X DEC ,X EOR #opr EOR opr EOR opr EOR opr,X EOR opr,X EOR ,X INC opr INCA INCX INC opr,X INC ,X JMP opr JMP opr JMP opr,X JMP opr,X JMP ,X
Operation
Description
M $00 A $00 X $00 M $00 M $00
H I NZC
Clear Byte
---- 0 1 --
DIR INH INH IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX DIR EXT IX2 IX1 IX
3F 4F 5F 6F 7F
dd
ff
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Compare Accumulator with Memory Byte
(A) - (M)
----
ii A1 2 B1 dd 3 C1 hh ll 4 D1 ee ff 5 E1 ff 4 F1 3 33 43 53 63 73 dd 5 3 3 6 5
Complement Byte (One's Complement)
M (M) = $FF - (M) A (A) = $FF - (A) X (X) = $FF - (X) M (M) = $FF - (M) M (M) = $FF - (M)
----
1
ff
Compare Index Register with Memory Byte
(X) - (M)
----
ii A3 2 B3 dd 3 C3 hh ll 4 D3 ee ff 5 E3 ff 4 F3 3 3A 4A 5A 6A 7A dd 5 3 3 6 5
Decrement Byte
M (M) - 1 A (A) - 1 X (X) - 1 M (M) - 1 M (M) - 1
----
--
ff
EXCLUSIVE OR Accumulator with Memory Byte
A (A) (M)
----
--
ii A8 2 B8 dd 3 C8 hh ll 4 D8 ee ff 5 E8 ff 4 F8 3 3C 4C 5C 6C 7C dd 5 3 3 6 5
Increment Byte
M (M) + 1 A (A) + 1 X (X) + 1 M (M) + 1 M (M) + 1
----
--
ff
Unconditional Jump
PC Jump Address
----------
BC dd 2 CC hh ll 3 DC ee ff 4 EC ff 3 FC 2
General Release Specification Instruction Set For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Cycles
5 3 3 6 5
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc.
Instruction Set Instruction Set Summary
Table 10-6. Instruction Set Summary (Continued)
Opcode Source Form
JSR opr JSR opr JSR opr,X JSR opr,X JSR ,X LDA #opr LDA opr LDA opr LDA opr,X LDA opr,X LDA ,X LDX #opr LDX opr LDX opr LDX opr,X LDX opr,X LDX ,X LSL opr LSLA LSLX LSL opr,X LSL ,X LSR opr LSRA LSRX LSR opr,X LSR ,X MUL NEG opr NEGA NEGX NEG opr,X NEG ,X NOP ORA #opr ORA opr ORA opr ORA opr,X ORA opr,X ORA ,X ROL opr ROLA ROLX ROL opr,X ROL ,X
Operation
Description
H I NZC
PC (PC) + n (n = 1, 2, or 3) Push (PCL); SP (SP) - 1 Push (PCH); SP (SP) - 1 PC Effective Address
Jump to Subroutine
----------
DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX DIR INH INH IX1 IX INH DIR INH INH IX1 IX INH IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX
BD dd 5 CD hh ll 6 DD ee ff 7 ED ff 6 FD 5 ii A6 2 B6 dd 3 C6 hh ll 4 D6 ee ff 5 E6 ff 4 F6 3 AE ii 2 BE dd 3 CE hh ll 4 DE ee ff 5 EE ff 4 FE 3 38 48 58 68 78 34 44 54 64 74 42 30 40 50 60 70 9D AA BA CA DA EA FA 39 49 59 69 79 ii dd hh ll ee ff ff dd dd dd 5 3 3 6 5 5 3 3 6 5 11 5 3 3 6 5 2 2 3 4 5 4 3 5 3 3 6 5
Freescale Semiconductor, Inc...
Load Accumulator with Memory Byte
A (M)
----
--
Load Index Register with Memory Byte
X (M)
----
--
Logical Shift Left (Same as ASL)
C b7 b0
0
----
ff dd
Logical Shift Right
0 b7 b0
C
---- 0
ff
Unsigned Multiply
X : A (X) x (A) M -(M) = $00 - (M) A -(A) = $00 - (A) X -(X) = $00 - (X) M -(M) = $00 - (M) M -(M) = $00 - (M)
0 ------ 0
Negate Byte (Two's Complement)
----
ff
No Operation
----------
Logical OR Accumulator with Memory
A (A) (M)
----
--
Rotate Byte Left through Carry Bit
C b7 b0
----
ff
MC68HC05RC16 -- Rev. 3.0 Instruction Set For More Information On This Product, Go to: www.freescale.com
General Release Specification
Cycles
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc. Instruction Set
Table 10-6. Instruction Set Summary (Continued)
Opcode Source Form
ROR opr RORA RORX ROR opr,X ROR ,X RSP
Operation
Description
H I NZC
Rotate Byte Right through Carry Bit
b7 b0
C
----
DIR INH INH IX1 IX INH
36 46 56 66 76 9C
dd
ff
Reset Stack Pointer
SP $00FF SP (SP) + 1; Pull (CCR) SP (SP) + 1; Pull (A) SP (SP) + 1; Pull (X) SP (SP) + 1; Pull (PCH) SP (SP) + 1; Pull (PCL) SP (SP) + 1; Pull (PCH) SP (SP) + 1; Pull (PCL)
----------
Freescale Semiconductor, Inc...
RTI
Return from Interrupt

INH
80
RTS SBC #opr SBC opr SBC opr SBC opr,X SBC opr,X SBC ,X SEC SEI STA opr STA opr STA opr,X STA opr,X STA ,X STOP STX opr STX opr STX opr,X STX opr,X STX ,X SUB #opr SUB opr SUB opr SUB opr,X SUB opr,X SUB ,X
Return from Subroutine
----------
INH IMM DIR EXT IX2 IX1 IX INH INH DIR EXT IX2 IX1 IX INH DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX
81
Subtract Memory Byte and Carry Bit from Accumulator
A (A) - (M) - (C)
----
ii A2 2 B2 dd 3 C2 hh ll 4 D2 ee ff 5 E2 ff 4 F2 3 99 9B B7 C7 D7 E7 F7 8E BF CF DF EF FF dd hh ll ee ff ff dd hh ll ee ff ff 2 2 4 5 6 5 4 2 4 5 6 5 4
Set Carry Bit Set Interrupt Mask
C1 I1
-------- 1 -- 1 ------
Store Accumulator in Memory
M (A)
----
--
Stop Oscillator and Enable IRQ Pin
-- 0 ------
Store Index Register In Memory
M (X)
----
--
Subtract Memory Byte from Accumulator
A (A) - (M)
----
ii A0 2 B0 dd 3 C0 hh ll 4 D0 ee ff 5 E0 ff 4 F0 3
SWI
Software Interrupt
PC (PC) + 1; Push (PCL) SP (SP) - 1; Push (PCH) SP (SP) - 1; Push (X) SP (SP) - 1; Push (A) -- 1 ------ SP (SP) - 1; Push (CCR) SP (SP) - 1; I 1 PCH Interrupt Vector High Byte PCL Interrupt Vector Low Byte X (A) ----------
INH
83
10
TAX
Transfer Accumulator to Index Register
INH
97
General Release Specification Instruction Set For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Cycles
5 3 3 6 5 2 9 6 2
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc.
Instruction Set Instruction Set Summary
Table 10-6. Instruction Set Summary (Continued)
Opcode Source Form
TST opr TSTA TSTX TST opr,X TST ,X TXA
Operation
Description
H I NZC
Test Memory Byte for Negative or Zero
(M) - $00
----
--
DIR INH INH IX1 IX INH INH
3D 4D 5D 6D 7D 9F 8F
dd
ff
Transfer Index Register to Accumulator Stop CPU Clock and Enable Interrupts Accumulator Carry/borrow flag Condition code register Direct address of operand Direct address of operand and relative offset of branch instruction Direct addressing mode High and low bytes of offset in indexed, 16-bit offset addressing Extended addressing mode Offset byte in indexed, 8-bit offset addressing Half-carry flag High and low bytes of operand address in extended addressing Interrupt mask Immediate operand byte Immediate addressing mode Inherent addressing mode Indexed, no offset addressing mode Indexed, 8-bit offset addressing mode Indexed, 16-bit offset addressing mode Memory location Negative flag Any bit
A (X)
---------- -- 0------
Freescale Semiconductor, Inc...
WAIT A C CCR dd dd rr DIR ee ff EXT ff H hh ll I ii IMM INH IX IX1 IX2 M N n
2
opr PC PCH PCL REL rel rr SP X Z # () -( ) ? : --
Operand (one or two bytes) Program counter Program counter high byte Program counter low byte Relative addressing mode Relative program counter offset byte Relative program counter offset byte Stack pointer Index register Zero flag Immediate value Logical AND Logical OR Logical EXCLUSIVE OR Contents of Negation (two's complement) Loaded with If Concatenated with Set or cleared Not affected
MC68HC05RC16 -- Rev. 3.0 Instruction Set For More Information On This Product, Go to: www.freescale.com
General Release Specification
Cycles
4 3 3 5 4 2
Effect on CCR
Operand
Address Mode
Instruction Set
Table 10-7. Opcode Map
Bit Manipulation DIR DIR
MSB LSB
Freescale Semiconductor, Inc...
102 Instruction Set MOTOROLA
General Release Specification
Branch REL 2
DIR 3
Read-Modify-Write INH INH IX1 4 5 6
IX 7
Control INH INH 8
9 RTI INH 6 RTS INH
IMM A
2 SUB IMM 2 2 CMP IMM 2 2 SBC IMM 2 2 CPX IMM 2 2 AND IMM 2 2 BIT IMM 2 2 LDA IMM 2 2 2 EOR IMM 2 2 ADC IMM 2 2 ORA IMM 2 2 ADD IMM 2 2
DIR B
Register/Memory EXT IX2 C
4 SUB EXT 3 4 CMP EXT 3 4 SBC EXT 3 4 CPX EXT 3 4 AND EXT 3 4 BIT EXT 3 4 LDA EXT 3 5 STA EXT 3 4 EOR EXT 3 4 ADC EXT 3 4 ORA EXT 3 4 ADD EXT 3 3 JMP EXT 3 6 JSR EXT 3 4 LDX EXT 3 5 STX EXT 3
IX1 E
4 SUB IX1 1 4 CMP IX1 1 4 SBC IX1 1 4 CPX IX1 1 4 AND IX1 1 4 BIT IX1 1 4 LDA IX1 1 5 STA IX1 1 4 EOR IX1 1 4 ADC IX1 1 4 ORA IX1 1 4 ADD IX1 1 3 JMP IX1 1 6 JSR IX1 1 4 LDX IX1 1 5 STX IX1 1
IX F
3 SUB IX 3 CMP IX 3 SBC IX 3 CPX IX 3 AND IX 3 BIT IX 3 LDA IX 4 STA IX 3 EOR IX 3 ADC IX 3 ORA IX 3 ADD IX 2 JMP IX 5 JSR IX 3 LDX IX 4 STX IX MSB LSB
0
1
9
D
5 SUB IX2 2 5 CMP IX2 2 5 SBC IX2 2 5 CPX IX2 2 5 AND IX2 2 5 BIT IX2 2 5 LDA IX2 2 6 STA IX2 2 5 EOR IX2 2 5 ADC IX2 2 5 ORA IX2 2 5 ADD IX2 2 4 JMP IX2 2 7 JSR IX2 2 5 LDX IX2 2 6 STX IX2 2
0 1 2 3 4 5 6 7 8 9
A B C D E F
5 5 3 5 3 3 6 5 BRSET0 BSET0 BRA NEG NEGA NEGX NEG NEG 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1 5 5 3 BRCLR0 BCLR0 BRN 3 DIR 2 DIR 2 REL 1 5 5 3 11 BRSET1 BSET1 BHI MUL 3 DIR 2 DIR 2 REL 1 INH 5 5 3 5 3 3 6 5 BRCLR1 BCLR1 BLS COM COMA COMX COM COM 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1 5 5 3 5 3 3 6 5 BRSET2 BSET2 BCC LSR LSRA LSRX LSR LSR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRCLR2 BCLR2 BCS/BLO 3 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRSET3 BSET3 BNE ROR RORA RORX ROR ROR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRCLR3 BCLR3 BEQ ASR ASRA ASRX ASR ASR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRSET4 BSET4 BHCC ASL/LSL ASLA/LSLA ASLX/LSLX ASL/LSL ASL/LSL 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRCLR4 BCLR4 BHCS ROL ROLA ROLX ROL ROL 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRSET5 BSET5 BPL DEC DECA DECX DEC DEC 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRCLR5 BCLR5 BMI 3 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRSET6 BSET6 BMC INC INCA INCX INC INC 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 4 3 3 5 4 BRCLR6 BCLR6 BMS TST TSTA TSTX TST TST 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRSET7 BSET7 BIL 3 DIR 2 DIR 2 REL 1 5 5 3 5 3 3 6 5 BRCLR7 BCLR7 BIH CLR CLRA CLRX CLR CLR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1
2 2 2
10 SWI INH
2 2 2 2 1 1 1 1 1 1 1 2 TAX INH 2 CLC INH 2 2 SEC INH 2 2 CLI INH 2 2 SEI INH 2 2 RSP INH 2 NOP INH 2
2 STOP INH 2 2 WAIT TXA INH 1 INH
6 BSR REL 2 2 LDX 2 IMM 2 2 MSB LSB
3 SUB DIR 3 3 CMP DIR 3 3 SBC DIR 3 3 CPX DIR 3 3 AND DIR 3 3 BIT DIR 3 3 LDA DIR 3 4 STA DIR 3 3 EOR DIR 3 3 ADC DIR 3 3 ORA DIR 3 3 ADD DIR 3 2 JMP DIR 3 5 JSR DIR 3 3 LDX DIR 3 4 STX DIR 3
0 1 2 3 4 5 6 7 8 9 A B C D E F
MC68HC05RC16 -- Rev. 3.0
INH = Inherent IMM = Immediate DIR = Direct EXT = Extended
REL = Relative IX = Indexed, No Offset IX1 = Indexed, 8-Bit Offset IX2 = Indexed, 16-Bit Offset
0
MSB of Opcode in Hexadecimal
LSB of Opcode in Hexadecimal
0
5 Number of Cycles BRSET0 Opcode Mnemonic 3 DIR Number of Bytes/Addressing Mode
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Section 11. Electrical Specifications
11.1 Contents
11.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105 DC Electrical Characteristics (5.0 Vdc). . . . . . . . . . . . . . . . . .106 DC Electrical Characteristics (2.2 Vdc). . . . . . . . . . . . . . . . . .107 Control Timing (5.0 Vdc and 2.2 Vdc). . . . . . . . . . . . . . . . . . .109
Freescale Semiconductor, Inc...
11.3 11.4 11.5 11.6 11.7 11.8
11.2 Introduction
This section contains the electrical and timing specifications.
MC68HC05RC16 -- Rev. 3.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Electrical Specifications 11.3 Maximum Ratings
Maximum ratings are the extreme limits to which the MCU can be exposed without permanently damaging it. The MCU contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIN and VOUT within the range VSS (VIN or VOUT) VDD. Connect unused inputs to the appropriate voltage level, either VSS or VDD.
Freescale Semiconductor, Inc...
Rating Supply Voltage Burn-In Mode (IRQ Pin Only) Current Drain Per Pin Excluding VDD and VSS Operating Junction Temperature Storage Temperature Range
Symbol VDD VIN I TJ Tstg
Value -0.3 to +7.0 VSS -0.3 to 2 x VDD + 0.3 25 +150 -65 to +150
Unit V V mA C C
NOTE:
This device is not guaranteed to operate properly at the maximum ratings. Refer to 11.6 DC Electrical Characteristics (5.0 Vdc) and 11.7 DC Electrical Characteristics (2.2 Vdc) for guaranteed operating conditions.
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Electrical Specifications Operating Range
11.4 Operating Range
Characteristic Operating Temperature Range MC68HC05RC16 (Standard) Symbol TA Value TL to TH 0 to +70 Unit C
11.5 Thermal Characteristics
Freescale Semiconductor, Inc...
Characteristic Thermal Resistance Plastic Dual In-Line Package Small Outline Intergrated Circuit Package Plastic Leaded Chip Carrier Package
Symbol
Value 60 60 60
Unit
JA
C/W
MC68HC05RC16 -- Rev. 3.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Electrical Specifications 11.6 DC Electrical Characteristics (5.0 Vdc)
Characteristic Output Voltage ILOAD = 10.0 A ILOAD = -10.0 A Output High Voltage (ILOAD -2.0 mA) Port A, Port B, Port C (1-7) (ILOAD -20 mA) IRO (ILOAD -4.0 mA) Port C (Bit 0) Symbol VOL VOH VOH Min -- VDD- 0.1 VDD -0.8 VDD -0.8 VDD -0.8 -- -- -- 0.7 x VDD Typ -- -- VDD -0.2 VDD -0.2 VDD -0.2 0.2 0.2 0.2 -- Max 0.1 -- -- -- -- 0.4 0.4 0.4 VDD Unit V
V
Freescale Semiconductor, Inc...
Output Low Voltage (ILOAD = 3.0 mA) Port A, Port B, Port C (1-7) (ILOAD = 25.0 mA) IRO (ILOAD = 20.0 mA) Port C (Bit 0) Input High Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Input Low Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Supply Current (see Notes) Run Wait Stop 25 oC 0 to +70 oC I/O Ports Hi-Z Leakage Current Port A, Port B, Port C Input Current RESET, LPRST, IRQ, OSC1 PB0-PB7 with Pullups Enabled (VIN = 0.2 x VDD)8 PB0-PB7 with Pullups Enabled (VIN = 0.7 x VDD) Capacitance Ports (as Input or Output) RESET, LPRST, IRQ
VOL
V
VIH
V
VIL
VSS
--
0.2 x VDD
V
IDD
-- -- -- --
2.3 0.5 0.3 0.3 -- -- -330 -120 -- --
4.0 1.0 10.0 20.0 10 1 -700 -300 12 8
mA mA A A A
IOZ
-10 -1
IIN
-100 -50
A
COUT CINT
-- --
pF
NOTES: 1. VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. Typical values at midpoint of voltage range, 25 C only, represent average measurements. 3. Wait IDD: only core timer active 4. Run (Operating) IDD, wait IDD: Measured using external square wave clock source (fOsc = 4.2 MHz); all inputs 0.2 V from rail; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2 5. Wait, Stop IDD: Port A and port C configured as inputs, port B configured as outputs, VIL = 0.2 V, VIH = VDD -0.2 V 6. Stop IDD is measured with OSC1 = VSS. 7. Wait IDD is affected linearly by the OSC2 capacitance. 8. Pullups are designed to be capable of pulling to VIH within 1 s for a 100 pF, 4-k load.
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Electrical Specifications DC Electrical Characteristics (2.2 Vdc)
11.7 DC Electrical Characteristics (2.2 Vdc)
Characteristic Output Voltage ILOAD = 10.0 A ILOAD = -10.0 A Output High Voltage (ILOAD -0.6 mA) Port A, Port B, Port C (1-7) (ILOAD -8.0 mA) IRO (ILOAD -1.2 mA) Port C (Bit 0) Symbol VOL VOH VOH Min -- VDD- 0.1 VDD- 0.3 VDD- 0.3 VDD- 0.3 -- -- -- 0.7 x VDD VSS -- -- -- -- IOZ -4 Typ -- -- VDD- 0.1 VDD- 0.1 VDD- 0.1 0.1 0.1 0.1 -- -- Max 0.1 -- -- -- -- 0.3 0.3 0.3 VDD 0.4 x VDD 1.0 0.3 1.0 4.0 4 Unit V
V
Freescale Semiconductor, Inc...
Output Low Voltage (ILOAD = 1.0 mA) Port A, Port B, Port C (1-7) (ILOAD = 8.0 mA) IRO (ILOAD = 7.0 mA) Port C (Bit 0) Input High Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Input Low Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Supply Current (see Notes) Run Wait Stop 25 oC 0 to +70 oC I/O Ports Hi-Z Leakage Current Port A, Port B, Port C Input Current RESET, LPRST, IRQ, OSC1 PB0-PB7 with Pullups Enabled (VIN = 0.4 x VDD) 8 PB0-PB7 with Pullups Enabled (VIN = 0.7 x VDD) Capacitance Ports (as Input or Output) RESET, LPRST, IRQ
VOL
V
VIH VIL
V V
IDD
0.3 0.15 0.1 0.1 --
mA mA A A A
-0.4 IIN -25 -15 COUT CINT -- --
-- -50 -34 -- --
0.4 -105 -65 12 8 pF A
NOTES: 1. VDD = 2.2 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. Typical values at midpoint of voltage range, 25 C only, represent average measurements. 3. Wait IDD: only core timer active 4. Run (Operating) IDD, wait IDD: Measured using external square wave clock source (fOsc = 4.2 MHz); all inputs 0.2 V from rail; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2 5. Wait, Stop IDD: Port A and port C configured as inputs, port B configured as outputs, VIL = 0.2 V, VIH = VDD -0.2 V 6. Stop IDD is measured with OSC1 = VSS. 7. Wait IDD is affected linearly by the OSC2 capacitance. 8. Pullups are designed to be capable of pulling to VIH within 25 s for a 100 pF, 4-k load.
MC68HC05RC16 -- Rev. 3.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Electrical Specifications
4.0 VDD = 5.5 V TA = -0 C to 70 C SUPPLY CURRENT (mA) 3.0
2.0
RU
1.0
N
I DD
WAIT
I DD
Freescale Semiconductor, Inc...
STOP IDD (20 A) 0 0 0.5 1.0 1.5 INTERNAL CLOCK FREQUENCY (MHz) XTAL / 2 2.0 2.1 2.5
1.0 VDD = 2.4 V TA = -0 C to 70 C 0.8 SUPPLY CURRENT (mA)
0.6
N RU
I DD
0.4 0.3 0.2
WAIT I DD
STOP IDD (4 A) 0 0 0.5 2.0 2.1 INTERNAL CLOCK FREQUENCY (MHz) XTAL / 2 1.0 1.5 2.5
Figure 11-1. Maximum Supply Current versus Internal Clock Frequency
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Electrical Specifications Control Timing (5.0 Vdc and 2.2 Vdc)
11.8 Control Timing (5.0 Vdc and 2.2 Vdc)
Characteristic Frequency of Operation Crystal External Clock Internal Operating Frequency Crystal (fOSC /2) External Clock (fOSC /2) Cycle Time Symbol fosc Min -- dc -- dc 480 -- -- 1.5 125 Note 2 90 Max 4.2 4.2 2.1 2.1 -- 100 100 -- -- -- -- Unit MHz
fop tcyc tOXOV tILCH tRL tILIH tILIL tOH, tOL
MHz ns ms ms tcyc ns tcyc ns
Freescale Semiconductor, Inc...
Crystal Oscillator Startup Time Stop Recovery Startup Time (Crystal Oscillator) RESET Pulse Width Interrupt Pulse Width Low (Edge-Triggered) Interrupt Pulse Period OSC1 Pulse Width
NOTES: 1. VDD = 2.0 to 5.5 Vdc, VSS = 0 Vdc, TA = 0 oC to +70 oC, unless otherwise noted 2. The minimum period, tILI, should not be less than the number of cycle times it takes to execute the interrupt service routine plus 19 tCYC.
MC68HC05RC16 -- Rev. 3.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Electrical Specifications
Freescale Semiconductor, Inc...
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Section 12. Mechanical Specifications
12.1 Contents
12.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 28-Pin Plastic Dual-In-Line Package (Case 710-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112 28-Pin Small Outline Integrated Circuit Package (Case 751F-04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112 44-Pin Plastic Leaded Chip Carrier Package (Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Freescale Semiconductor, Inc...
12.3 12.4 12.5
12.2 Introduction
This section describes the dimensions of the dual-in-line package (DIP), small outline integrated circuit (SOIC), and plastic leaded chip carrier (PLCC) MCU packages. The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following: * * Local Motorola Sales Office Motorola Mfax - Phone 602-244-6609 - EMAIL rmfax0@email.sps.mot.com Worldwide Web (wwweb) at http://design-net.com
*
Follow Mfax or wwweb on-line instructions to retrieve the current mechanical specifications.
MC68HC05RC16 -- Rev. 3.0 Mechanical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Mechanical Specifications 12.3 28-Pin Plastic Dual In-Line Package (Case 710-02)
NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25mm (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0 15 0.51 1.02 INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0 15 0.020 0.040
28
15
B
1 14
A
C N
L
Freescale Semiconductor, Inc...
H
G F D
K
SEATING PLANE
M
J
12.4 28-Pin Small Outline Integrated Circuit Package (Case 751F-04)
-A28 15 14X
-B1 14
P 0.010 (0.25)
M
B
M
28X D
0.010 (0.25)
M
T
A
S
B
S
M R X 45
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 17.80 18.05 7.60 7.40 2.65 2.35 0.49 0.35 0.90 0.41 1.27 BSC 0.32 0.23 0.29 0.13 8 0 10.05 10.55 0.75 0.25 INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 8 0 0.395 0.415 0.010 0.029
-T26X
C G K -TSEATING PLANE
F J
General Release Specification Mechanical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Mechanical Specifications 44-Pin Plastic Leaded Chip Carrier Package (Case 777-02)
12.5 44-Pin Plastic Leaded Chip Carrier Package (Case 777-02)
-NY BRK D B 0.007(0.180) M T U L-M S NS NS
0.007(0.180) M T
L-M S
Z -L-M-
Freescale Semiconductor, Inc...
V
44 1
W
D
X VIEW D-D
G1 0.010 (0.25) S T L-M S NS
A R Z
0.007(0.180) M T 0.007(0.180) M T
L-M S L-M S
NS NS H 0.007(0.180) M T L-M S NS
J E C G -TG1 0.010 (0.25) S T L-M S NS VIEW S VIEW S
NOTES: 1. DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOLDERS EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSION R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF THE MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMINSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTUSION(S) SHALL NOT CAUSE THE H DIMINSION TO BE GREATER THAN 0.037 (0.940114). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMINISION TO SMALLER THAN 0.025 (0.635).
K1 0.004 (0.10)
SEATING PLANE K
F 0.007(0.180) M T L-M S NS
INCHES DIM A B C E F G H J K R U V W X Y Z G1 K1 MIN MAX 0.685 0.695 0.685 0.695 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 0.025 0.650 0.656 0.650 0.656 0.042 0.048 0.042 0.048 0.042 0.056 0.020 2 10 0.610 0.630 0.040
MILLIMETERS MIN MAX 17.40 17.65 17.40 17.65 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 0.64 16.51 16.66 16.51 16.66 1.07 1.21 1.07 1.21 1.07 1.42 0.50 2 10 15.50 16.00 1.02
MC68HC05RC16 -- Rev. 3.0 Mechanical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Mechanical Specifications
Freescale Semiconductor, Inc...
General Release Specification Mechanical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Section 13. Ordering Information
13.1 Contents
13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 MCU Ordering Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 Application Program Media. . . . . . . . . . . . . . . . . . . . . . . . . . .116 ROM Program Verification . . . . . . . . . . . . . . . . . . . . . . . . . . .117 ROM Verification Units (RVUs). . . . . . . . . . . . . . . . . . . . . . . .118 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
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13.3 13.4 13.5 13.6 13.7
13.2 Introduction
This section contains ordering instructions for the MC68HC705RC16.
13.3 MCU Ordering Forms
To initiate an order for a ROM-based MCU, first obtain the current ordering form for the MCU from a Motorola representative. Submit the following items when ordering MCUs: * * * A current MCU ordering form that is completely filled out (Contact your Motorola sales office for assistance.) A copy of the customer specification if the customer specification deviates from the Motorola specification for the MCU Customer's application program on one of the media listed in 13.4 Application Program Media
MC68HC05RC16 -- Rev. 3.0 Ordering Information For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. Ordering Information
The current MCU ordering form is also available through the Motorola Freeware Bulletin Board Service (BBS). The telephone number is (512) 891-FREE. After making the connection, type bbs in lower-case letters. Then press the return key to start the BBS software.
13.4 Application Program Media
Please deliver the application program to Motorola in one of the following media:
Freescale Semiconductor, Inc...
* * *
Macintosh(R)1 3 1/2-inch diskette (double-sided 800K or double-sided high-density 1.4 M) MS-DOS(R)2 or PC-DOSTM3 3 1/2-inch diskette (double-sided 720 K or double-sided high-density 1.44 M) MS-DOS(R) or PC-DOSTM 5 1/4-inch diskette (double-sided doubledensity 360 K or double-sided high-density 1.2 M)
Use positive logic for data and addresses. When submitting the application program on a diskette, clearly label the diskette with the following information: * * * * * * * Customer name Customer part number Project or product name File name of object code Date Name of operating system that formatted diskette Formatted capacity of diskette
On diskettes, the application program must be in Motorola's S-record format (S1 and S9 records), a character-based object file format generated by M6805 cross assemblers and linkers.
1. Macintosh is a registered trademark of Apple Computer, Inc. 2. MS-DOS is a registered trademark of Microsoft Corporation. 3. PC-DOS is a trademark of International Business Machines Corporation. General Release Specification Ordering Information For More Information On This Product, Go to: www.freescale.com MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
Ordering Information ROM Program Verification
NOTE:
Begin the application program at the first user ROM location. Program addresses must correspond exactly to the available on-chip user ROM addresses as shown in the memory map. Write $00 in all nonuser ROM locations or leave all nonuser ROM locations blank. Refer to the current MCU ordering form for additional requirements. Motorola may request pattern re-submission if nonuser areas contain any nonzero code.
If the memory map has two user ROM areas with the same address, then write the two areas in separate files on the diskette. Label the diskette with both file names.
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In addition to the object code, a file containing the source code can be included. Motorola keeps this code confidential and uses it only to expedite ROM pattern generation in case of any difficulty with the object code. Label the diskette with the file name of the source code.
13.5 ROM Program Verification
The primary use for the on-chip ROM is to hold the customer's application program. The customer develops and debugs the application program and then submits the MCU order along with the application program. Motorola inputs the customer's application program code into a computer program that generates a listing verify file. The listing verify file represents the memory map of the MCU. The listing verify file contains the user ROM code and may also contain nonuser ROM code, such as self-check code. Motorola sends the customer a computer printout of the listing verify file along with a listing verify form. To aid the customer in checking the listing verify file, Motorola will program the listing verify file into customer-supplied blank preformatted Macintosh or DOS disks. All original pattern media are filed for contractual purposes and are not returned. Check the listing verify file thoroughly, then complete and sign the listing verify form and return the listing verify form to Motorola. The signed listing verify form constitutes the contractual agreement for the creation of the custom mask.
MC68HC05RC16 -- Rev. 3.0 Ordering Information For More Information On This Product, Go to: www.freescale.com General Release Specification
Freescale Semiconductor, Inc. Ordering Information 13.6 ROM Verification Units (RVUs)
After receiving the signed listing verify form, Motorola manufactures a custom photographic mask. The mask contains the customer's application program and is used to process silicon wafers. The application program cannot be changed after the manufacture of the mask begins. Motorola then produces 10 MCUs, called RVUs, and sends the RVUs to the customer. RVUs are usually packaged in unmarked ceramic and tested to 5 Vdc at room temperature. RVUs are not tested to environmental extremes because their sole purpose is to demonstrate that the customer's user ROM pattern was properly implemented. The 10 RVUs are free of charge with the minimum order quantity. These units are not to be used for qualification or production. RVUs are not guaranteed by Motorola Quality Assurance.
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13.7 MC Order Numbers
Table 13-1 provides information in determing order numbers. Table 13-1. MC Order Numbers
Package Type 28-Pin Plastic Dual In-Line Package (DIP) 28-Pin Small Outline Integrated Circuit Package (SOIC) 44-Pin Plastic Leaded Chip Carrier (PLCC) Operating Temperature Range 0 to 70 C 0 to 70 C 0 to 70 C MC Order Number MC68HC05RC8P MC68HC05RC16P MC68HC05RC8DW MC68HC05RC16DW MC68HC05RC8FN MC68HC05RC16FN
General Release Specification Ordering Information For More Information On This Product, Go to: www.freescale.com
MC68HC05RC16 -- Rev. 3.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC16
Appendix A. MC68HC05RC8
A.1 Contents
A.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141
Freescale Semiconductor, Inc...
A.3
A.2 Introduction
Appendix A introduces the MC68HC05RC8. The technical data applying to the MC68HC05RC16 applies to the MC68HC05RC8 with the exceptions given in this appendix.
A.3 Memory Map
Both the MC68HC05RC8 and the MC68HC05RC16 have 16-Kbyte memory maps consisting of user ROM, RAM, burn-in ROM, and input/output (I/O). However, the user ROM for the MC68HC05RC8 consists of only 8112 bytes of ROM. Figure A-1 shows the MC68HC05RC8 memory map in user mode.
MC68HC05RC16 -- Rev. 3.0 MC68HC05RC8 For More Information On This Product, Go to: www.freescale.com
General Release Specification
Freescale Semiconductor, Inc. MC68HC05RC8
$0000 $001F $0020
I/O 32 BYTES
0000 0031 0032
PORT A DATA REGISTER PORT B DATA REGISTER PORT C DATA REGISTER RESERVED PORT A DATA DIRECTION REGISTER
$00 $01 $02 $03 $04 $05 $06 $07
RAM 160 BYTES $00BF $00C0 $00FF $0100 $017F $0180 0191 0192 0255 0256 0383 0384
PORT B DATA DIRECTION REGISTER PORT C DATA DIRECTION REGISTER RESERVED
STACK 64 BYTES RAM 128 BYTES
CORE TIMER CONTROL & STATUS REG. $08 CORE TIMER COUNTER REGISTER RESERVED $09 $0A
Freescale Semiconductor, Inc...
UNUSED
.......
$1FFF $2000 USER ROM 8112 BYTES $3FAF $3FB0 BURN-IN ROM & VECTORS 64 BYTES USER VECTORS 16 BYTES 16303 16304
RESERVED IR TIMER CHR1 IR TIMER CLR1 IR TIMER CHR2 IR TIMER CLR2 IR TIMER MCSR IR TIMER MDR1 IR TIMER MDR2 IR TIMER MDR3 RESERVED RESERVED RESERVED UNUSED UNUSED CORE TIMER VECTOR (HIGH BYTE) CORE TIMER VECTOR (LOW BYTE) IR TIMER VECTOR (HIGH BYTE) IR TIMER VECTOR (LOW BYTE) IRQ/PTB KEYSCAN PULLUPS VECTOR (HIGH BYTE) IRQ/PTB KEYSCAN PULLUPS VECTOR (LOW BYTE) SWI VECTOR (HIGH BYTE) SWI VECTOR (LOW BYTE) RESET VECTOR (HIGH BYTE) RESET VECTOR (LOW BYTE)
$3FEF $3FF0 $3FFF
16367 16368 16383
Figure A-1. MC68HC05RC8 Memory Map
General Release Specification MC68HC05RC8 For More Information On This Product, Go to: www.freescale.com MC68HC05RC16 -- Rev. 3.0
...
$3FF5 $3FF6 $3FF7 $3FF8 $3FF9 $3FFA $3FFB $3FFC $3FFD $3FFE $3FFF
..
$1E $1F $3FF0
.......
$0F $10 $11 $12 $13 $14 $15 $16 $17 $18
Freescale Semiconductor, Inc.
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For More Information On This Product, Go to: www.freescale.com
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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.
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HC05RC16GRS/D


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